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RTW IPC APEX EXPO 2019: Comet Group's Lab One Facility in Silicon Valley

Joe Fjelstad speaks with Ken Burden, senior director of North American field service, and Craig Arcuri, business development, about Comet Group’s Silicon Valley-based Lab One customer center, which is a key resource for a variety of testing and inspection services, and also offers opportunities to collaborate with Comet Group's industry experts.

Award-winning Koh Young Process Optimizer

Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.

Dan Schoenfelder: Searching for Parts in Real Time

The I-Connect007 editors recently sat down with Dan Schoenfelder, vice president of business development at Octopart. We discussed online parts libraries and the impact they can have on choosing parts based on availability data during the design process.

Improving the Efficiency of Your PCBA Production

Ensuring you're hitting your build times is always a major priority in surface mount production. The challenge for many OEMs, however, is that the processes involved with PCBA can be numerous and complex. And the smallest of details can make the biggest of differences.

Flex Circuit Supply Chain Challenges

In our recent Flex and Rigid-Flex survey, we asked the following question: "Do you have problems with your flex circuit supply chain?" Below are just a few of the explanations of those who answered "Yes", slightly edited for clarity.

RTW IPC APEX EXPO 2019: Electrolube Discusses Overcoming Secondary Cure Issues

Phil Kinner, technical director of Electrolube's coatings division, speaks with I-Connect007 Technical Editor Pete Starkey about how secondary cure issues with UV conformal coatings have been overcome and shows some typical examples.

RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers

Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.

RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program

Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.

Super Dry Storage Options to Manage Intermetallic Growth

Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.

RTW IPC APEX EXPO: Zentech on the Fourth Pillar of DoD Acquisitions, and NIST

Steve Williams speaks with John Vaughan, VP of sales and marketing for Zentech, about their dominance in the military/aerospace market sector, the new "fourth pillar of DoD acquisitions," and how companies that do not take the NIST initiative seriously will be quickly left behind.


Supply Chain in Crisis

In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.

Critical Process Issues

In our recent I-Connect007 survey, we asked what the top three critical issues are in the production process. Below are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: ASM Updates Mid-Level Machines

ASM CEO Americas Jeffery L. Timms and Technica President and CEO Frank Medina give Nolan Johnson a product update on ASM's mid-speed machines—EbySIPLACE and EbyDEK. By bringing key features from ASM's high-end products to their new mid-level models, ASM's new machines are gaining attention Timms and Medina discuss the how and why.

RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner

In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.

IPC APEX EXPO 2019 Show Week Time-lapse Video

From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.

RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability

Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.

RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology

Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.

Benefits of Jet Printing Solder Pastes

In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

Day One, Nothing but Fun: The Show Warms Up

The first official day of the IPC APEX EXPO 2019 was full of excitement, activity and business getting done. From the exuberant crowd at the ribbon cutting ceremony, to the closing moments of day number one, the show floor was bustling. Spirits were high from both attendees and exhibitors, sending the signal that optimism and business strength are still the industry mood.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.


IPC Conferences Set the Tone for Innovation During IPC APEX EXPO 2019

Monday's docket of sessions at IPC APEX EXPO 2019 presented a wide-ranging array of topics, including the Automotive Executive Forum, the Connected Factory Initiative Workgroup mapping out the future of CFX, the DFX committee celebrating the release of the IPC 2231 Guidelines document, and the Critical Components Traceability Workgroup addressing the creation of a secure supply chain.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

In the Studio: Real Time with…IPC

It's almost time for IPC APEX EXPO 2019 at the San Diego Convention Center, and that means another Real Time with…IPC video program bringing you interviews with the electronics industry's top movers and shakers, engineers, and managers.

Most Important Attributes of Customer Service

In a recent I-Connect007 survey, we asked what the most important attributes of customer service are. Understanding and meeting the customer's needs and expectations top the list, followed by quality of service, and on-time delivery.

Electrolube Overcomes Secondary Cure Issues with New UV-cured Conformal Coatings

Electrolube Managing Director Ron Jakeman and Marketing Manager Julia Vorley speak with I-Connect007 Technical Editor Pete Starkey about the successful outcome of the international collaboration between the company's R&D teams in the UK and China, which resulted in a brand-new range of solvent-free UV-cured conformal coatings about to be launched at the upcoming IPC APEX EXPO 2019.

Mark Friedman on IPC Membership

Mark Friedman, a member success advocate at IPC, recently spoke with I-Connect007's Barry Matties about the current status of IPC's membership programs, the recent growth they've seen, and some hidden benefits of IPC membership that potential members might not be considering.

STEM: The Future of Our Industry

Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.

IPC APEX EXPO 2019 to Demo Operating CFX Line

A year on from their first demonstration, IPC’s Connected Factory Exchange (CFX) now nears the release of version 1.0 at this year’s upcoming IPC APEX EXPO. The I-Connect007 team spoke with CFX specialists Michael Ford and Dave Bergman about how far the program has come from the first initial public demo all the way through now becoming a published standard, and what users can expect from the demonstrations planned for the 2019 show.

Mentor and Seica Partner for Data Prep and Testing Big Boards

Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

The Future of the Customer Experience in Mobility

Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.


Solder Paste Selection/Qualification

In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Shopping at IPC APEX EXPO: Evolutionary or Revolutionary Products?

As you're finalizing your shopping list, take a second to consider this: Are you in the market for products that are evolutionary or revolutionary? And what do those terms even mean for someone looking for new DFM software or a new pick-and-place machine?

Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics

Senior-level executives from across the global electronics supply chain will gather to discuss opportunities and challenges facing the rapidly changing automotive electronics industry. With five expert speakers and a powerful keynote from GreenSource VP Alex Stepinski, registration will fill fast.

Dispatches from CES 2019: The Future in the Kickoff

Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.

Who’s the Best of the Best in Hand Soldering?

IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.

More Than Inspection: It’s Process Improvement

Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.

Most Important Feedback

In our recent I-Connect007 survey, we asked the following question: “What is the most important feedback that you receive after your board is manufactured?” Here are just a few of the replies, edited slightly for clarity.

Welcome to the BIG Show!

This month, we celebrate the impact and reach of the IPC APEX EXPO slated for January 26--31, 2019, in San Diego, California. Have something truly new? It needs to be seen here at IPC APEX EXPO with long-standing products and evolutionary advances from industry stalwarts will grow their installed base here, too. There are other industry shows, but the must-go show for our industry is IPC APEX EXPO.

Top 10 Most-Read SMT Interviews of 2018

We continue our top 10 lists, this time with the most-read SMT interviews in 2018. Topping the list is an interview with Joe O’Neil and Matthew Becker of Power Design Services (PDS), along with Ted Park of Green Circuits, who announced their merger last year.

Words of Advice

In our recent designer survey, we asked the following question: “What advice would you give an OEM system designer?” Here’s what our EMS experts said.


Top 10 Most-Read SMT007 Columns of 2018

Each year, we compile the lists of most-read news, articles and columns. Here are the top 10 most-read SMT007 columns from the past year.

Top 10 Most-Read SMT007 Articles of 2018

Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.

What Electronics Manufacturers Need to Know About RoHS 3 Compliance

On July 22, 2019, the latest incarnation of RoHS will come into full effect across the European Union. So, what’s changed? And what exactly are the implications for UK electronics manufacturers? This article provides a recap of what RoHS is, why it matters, and the steps that OEMs will need to take to ensure compliance.

Best Advice for Increasing Productivity

We recently asked the industry what their best advice is for increasing productivity. Here are just a few of the replies, edited slightly for clarity.

A Look at Medical Electronics Design and Assembly Challenges

We recently spoke with Dr. Despina Moschou, lecturer at the University of Bath, as well as Kaspars Fricbergs, VP of global quality, and Tom Reilly, director of marketing and sales operations, of EMS firm Vexos Corp., to learn more about the challenges and opportunities in medical electronics design and assembly, as well as the relevant regulatory and supply chain issues.

SMT Electrolytic Capacitor Solder Joint Criteria and Integrity Investigation

The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment.

Challenges in Flex Circuit Assembly

In a recent I-Connect007 survey on flex circuits, we asked the following question: What are some of the challenges that you face utilizing flex circuits? Here are just a few of the replies, edited slightly for clarity.

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.

Internet of Body: The Next Big Thing for Medical

Titu Botos, Ph.D., the VP of engineering at NeuronicWorks, discusses with I-Connect007 Managing Editor Nolan Johnson the next big thing to come after the Internet of Things (IoT)—the Internet of Body (IoB), which could include implantables and ingestible medical devices to monitor your body better.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.


How to Avoid Supply Chain Disruption this Chinese New Year

To avoid any negative impact on deliveries or lead-times during the Chinese New Year, the best tactic is to start planning early. And while there's no need to panic buy, you'll definitely want to think ahead when communicating with your PCB suppliers.

Greatest Challenges in Soldering

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

AOI Programs with a Magic Click

Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.

3D Printing and Medical Electronics: A Disruptive Beneficial Technology

We are seeing significant advances and increased uses for 3D manufacturing in medicine—many more than 3D-printed and conductive circuits on device structural components. There is enough movement in this area that 3D additive fabrication in medicine—including but not limited to 3D-printed circuits—has become its own topic, and one that we will be watching and continuing to cover.

What is ESD and Why Should We Worry About It?

The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.

I-Connect007 Research

In a recent SMT007 survey, we asked our readers how inspection has helped them improve their manufacturing process. Here are just a few of the answers, edited slightly for clarity.

Greg Vance on SMTA Ohio Chapter Updates

This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.

Is This a Golden Age for Medical Devices?

Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.

Electrolube on Managing Thermal Interfaces and Conformal Coatings

Electrolube's Jade Bridges, global technical support manager, speaks with I-Connect007 Technical Editor Pete Starkey about how to manage thermal interfaces for maximum heat transfer efficiency. She also provides an update on conformal coatings.

Solving the UK Manufacturing Productivity Puzzle

Since the financial crisis of 2008, manufacturing has seen an undeniable slump. Latest industry statistics paint a pretty compelling picture—where once the UK manufacturing sector was hot on the heels of its international counterparts, it now lags behind with average annual growth of less than 1% a year since the advent of the financial crisis. This article looks at five issues that could help to inform our decisions and boost performance within the sector.


Understanding the Benefits of CFX

In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.

I-Connect007 Research

In a recent I-Connect007 survey on flex circuits, we asked the following question: What are the major drivers causing you to utilize flex circuits? Here are just a few of the replies, edited slightly for clarity.

Tempo Automation's Open House Raises the Curtain in San Francisco

Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.

RTW SMTAI: Inventec Discusses the 'Green Way'

At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.

U.S. Career Opportunities with Electrolube

In a recent interview, Julia Vorley, group marketing manager for Electrolube, discusses a career opportunity Electrolube is seeking in the U.S. Read on to hear what they’re looking for in a technical account manager.

Training: One of The Best Investments You Can Make

Dan Patten, general manager at BEST Inc., speaks with I-Connect007's Barry Matties about the drivers behind the recent uptick in training from U.S. companies—from contract-driven training for certification levels to newfound demands from quality departments—and why reinvesting in the workforce is beneficial to all parties involved.

How Effective is Your Induction Process?

This article looks at eight ways manufacturers can ensure their induction process passes the 'so what' test. And more importantly, addresses all of the questions and concerns a new starter might have during their first couple of days.

A Look at Our Readers’ Manufacturing Challenges

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Solder Paste Jetting: An Integral Approach

Solder paste jetting is a technique that differs greatly from traditional solder paste deposition methods. In this article, solder paste jetting is compared with the other solder paste deposition methods—solder paste dispensing and solder paste printing and solder paste jetting—and highlights why it is becoming a viable option and how it increases the flexibility of a single production system.

Koh Young's Joel Scutchfield on Smart Factory Connectivity

Joel Scutchfield of Koh Young speaks with I-Connect007's Barry Matties about the struggles system providers currently face in implementing the machine-to-machine connectivity needed for a smart factory with no common platform or protocol in place yet.


Christine Pearsall on Tempo Automation and PCB West

Christine Pearsall, senior director of marketing for Tempo Automation, discusses with Consulting Technical Editor Tim Haag what services Tempo Automation provides, what attracts engineers and designers most to the company, and what events they plan to attend in the upcoming year.

Managing Cyber-Threats Within Electronics Manufacturing

The rise of the 4th Industrial Revolution (4IR) has brought with it digital interconnectivity that offers unprecedented opportunities for original equipment manufacturers (OEMs). But with that openness there also comes risk—the threat of the loss of data, the theft of capital or intellectual property, and the disruption of access to systems or operational technology—all of which can impede businesses and impact on trade.

Survey: Low-Temperature Soldering on PCBAs

The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

RTW SMTAI: KIC's MB Allen on Smart Factory, CFX

Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

How to Avoid Common Wave Soldering Issues

Wave soldering involves using waves of molten solder that act as glue to attach electrical components to the PCB. While this process is expedient and efficient in producing high-quality products, it sometimes experiences glitches that can be prevented or corrected. This article explores some of the main issues and how to remedy them.

Green Circuits' Joe O'Neil and Joe Garcia on the Best Kept Secret

Joe O'Neil, CEO, and Joe Garcia, VP of sales and marketing, at Green Circuits discuss with I-Connect007 Managing Editor Nolan Johnson about recruiting new employees, new training and certification requirements, tariffs, and more.

Challenges and Opportunities with CFX

Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.

4 Questions OEMs Typically Ask When Outsourcing

The decision to transfer your electronics manufacturing to an EMS company is a complex process, with the potential to impact your business, your staff, your customers and your suppliers in a multitude of ways. This article highlights four questions OEMs typically ask prospective contract manufacturing partners when they first start engaging with them—and our take on the answers.

I-Connect007 Survey Sees Bright Prospects for Low-Temperature Soldering

There has been an increasing amount of discussion on low-temperature soldering, and solder pastes. And why not? There are several advantages of using low temperature solders—from a technical standpoint and economic perspectives. A recent survey by I-Connect007 saw majority, or 67%, of the respondents saying they will consider using low-temperature solders in their assembly process.


Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.

Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications

Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

CFX: Building the Foundation for Industry 4.0

IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.

Pros and Cons of Dual Sourcing

Now, more than ever, there's a need for responsive and flexible supply chains. For OEMs, one solution to mitigate the risk of supply chain disruption is to maintain relationships with more than one supplier through dual sourcing—the practice of purchasing a chosen raw material, product, or service from two (or sometimes multiple) sources. Here are it's pros and cons.

Low-temperature Solder Paste Process Advantages

This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA components with SAC alloy spheres, and the advantages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities.

Meet Goepel electronic's New Managing Director, Alice Göpel

In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.

I-Connect007 Survey: Inspection Systems to See Increasing Use of 3D Technology

There is a critical need for inspection in the PCB assembly industry amid the continuing trend towards miniaturization in electronic systems and devices. Further, as solder joints become smaller and fine pitch becomes denser, the use of 3D technologies in inspection systems is becoming a must to help improve the quality and reliability of tests.

RTW SMTAI: Steve Greathouse Discusses Award, Highlights Need for New Engineers

Steve Greathouse, senior staff engineer at Plexus Corp., and recipient of SMTA’s Excellence in Leadership Award this year, speaks about the magic of the SMTA as a collaborative and supportive professional organization. He also discusses the need for “new blood” to join the manufacturing workforce as more senior engineers leave the industry.

RTW SMTAI: PalPilot on Adding Value to Design and Assembly

Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.

How to Measure Manufacturing Employee Engagement

Disgruntled employees have the ability to sap the lifeblood from your organization. And in some cases, one or two negative views can spread quickly throughout a business like an uncontrollable virus. While it is important to deal with issues the moment they arise, it is also vital to have a system in place to measure views and opinions on a regular basis and with a long-term view.


Taking an Independent Path: Strategies for Low Risk Sourcing of Components in a Constrained Market

Today, the challenges of a highly stressed supply chain are forcing many OEMs and EMS providers to rethink the way they source components. With parts such as multilayer ceramic capacitors (MLCCs) and other low-cost components in chronic shortage with extended lead times for delivery, manufacturers must be able to get these parts on-time at the lowest possible cost without assuming additional risk.

RTW SMTAI: Libra's Rod Howell Discusses Tariffs Issue

Rod Howell, CEO of EMS firm Libra Industries, speaks with I-Connect007 Managing Editor Nolan Johnson about the ongoing tariffs issue, how it impacts the global electronics manufacturing supply chain, and their strategic response to address the issue.

RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge

Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.

RTW SMTAI: Harold Sneath Highlights Alpha’s Reclaims Business

Reclamation can be a profit center, not a cost of doing business. At the recent SMTA International 2018 conference and exhibition, Harold Sneath, Eastern Regional Reclaim Manager at Alpha Assembly Solutions, lays out the reclamation services available through Alpha.

SMTAI 2018 Closes on a High Note

SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.

Real Time with...SMTAI 2018 Coverage Now Available

The I-Connect007 team traveled to Rosemont, Illinois this week to cover the SMTA International 2018 conference and exhibition. Video interviews of key executives and leaders of our industry are now available for viewing. Also check out the photo gallery for snapshots of the exhibition floor and the conference as well as the after-hours festivities.

Do's and Don'ts of Thermal Management Materials

Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.

AI-Powered Inspection

Viscom AG COO Peter Krippner discusses artificial intelligence (AI) and its impact in the electronics manufacturing industry. He speaks about how AI will change the industry, the challenges in adopting AI, and the state of implementation of AI in electronics manufacturing right now.

IoT: Driving Change in Manufacturing

In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.

How CIM and IoT Can Make Your Factory Smart

As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.


Tips to Improve Soldering Tip Life and Reduce Cost

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

The Smart Robot Revolution is Here

The distance between imagination and reality has reduced considerably. Thanks to advanced technologies such as artificial intelligence (AI), data processing, and machine vision, the science fiction writers' vision of smarter robots is becoming a reality. These more intelligent machines are also making a big impact in manufacturing.

Indium on Voiding and Auto Electronics Test Standard

In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.

The Megadrivers

Henry Ford's innovation in manufacturing—the moving assembly line—helped reduce the time it took to build a car from more than 12 hours to just two hours and 30 minutes. It was a revolutionary advancement in production. Through continuous improvements over decades, the assembly line has become the highly efficient primary mode of manufacturing in a wide range of industries and it has changed the way we live and work forever.

Electronic Components Market Update

Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.

RTW NEPCON South China: SEHO Discusses New Production Facility in South Korea

Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.

XR Update: Emerging Realities

The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.

RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering

Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.

RTW NEPCON South China: Viscom Increases 3D AXI Throughput

Guido Bornemann, head of sales for Asia at Viscom, speaks with Editor Edy Yu about the innovations in in-line 3D AXI systems that help manufacturers reduce handling time by about 40–50% and improve their throughputs.

Mexico: A New Hub for Electronics Manufacturing

With its competitive production costs, good logistical access, a skilled and deep talent pool and state-of-the-art technology, Mexico now produces everything from flat-screen televisions to smartphones and other consumer devices employing surface-mount technologies. Here's how Mexico’s strengths in electronics manufacturing services (EMS) evolved, and why more and more electronics manufacturers are moving to the country.


Mark Curtin on Large-Board Stencil Printing and Metal Squeegees

Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.

Should You Send Your PCB Assembler Loose Parts?

Everybody has a few loose PCB components lying around. Sometimes, it's a few chip caps left over from a hand-rework task, or maybe it's a tiny QFN or big old BGA. But, should you send your PCB assembler those loose parts? Read on.

Towards a Data-Driven Cleaning Environment

Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.

Why Clean?

In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?

Interview with a High School Robotics Team Mentor

On the floor of the recent Wisconsin SMTA Annual Tech Forum, I-Connect007 Technical Editor Happy Holden sat down with Aaron Denk, representing the local Cedarburg High School’s robotics team.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

Looking Under the Hood of MLCCs

The multilayer ceramic capacitor (MLCC) is one of the most widely used, and the most highly produced, passive devices in modern electronics manufacturing—with more than a thousand billion devices being produced worldwide every year. This article explores the evolution, applications and current state of the MLCC industry and what this means for electronics manufacturers.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Whitepaper: Electronics Cleanliness Testing

This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.

Getting More with Cleaning

The continuing growth of the electronics industry, driven by the rapid expansion of electronics into areas such as automotive and medical, is creating a new mindset with regard to cleaning, mainly due to quality and reliability issues. Read more to find out what our experts have to say when it comes to cleaning challenges in PCBAs and possible solutions.


A New Standard for Standards – From Data to Information

The main challenge we have today with our manufacturing standards is that they are deterministic, such as the 30% maximum void per ball for X-ray inspection of BGAs—which determines if a BGA assembly passes or fails. This article proposes a new perspective on setting pass and fail thresholds in the manufacturing line.

Is Component Testing Using ROSE Practical?

Industry experts are saying that Resistivity of Solvent Extract (ROSE) testing should be retired as a cleanliness or process control test in the PCB assembly industry. This article emphasizes that position by highlighting some work by the authors comparing component cleanliness results from the ROSE against Ion Chromatography (IC) results.

Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste

I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.

Newly Re-Branded Optel Software Lays Down China Strategy

Optimal Electronics Corp., a provider of smart software solutions for electronics assembly, recently rebranded globally as Optel Software, as it starts its venture in China. In an interview with SMT007 Magazine, Dr. Ranko Vujosevic, CEO and CTO, updates on the latest developments from the company and discusses their plans in China and Asia this year.

3D Printing: Enabling a New Manufacturing Landscape

At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.

Riding Out the Electronic Components Crisis is No Longer an Option

The electronic components shortage is continuing to take its toll on the electronics manufacturing sector. As market demand outstrips manufacturing capacity, the fallout from the components crisis is now predicted to extend well into 2020, and beyond. And it’s a problem which OEMs can no longer hope to simply ride out. Find out what you can do to address this issue.

Inspection and Design for Testability

In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.

Practicing Best Practices

Recently, we looked into electronics assembly best practices that help optimize your manufacturing processes. To provide you more insights on this, here's an interview with two assembly experts: Jason Keeping of EMS firm Celestica, and Bob Willis, a renowned EMS consultant and trainer.

Best Practices in Manufacturing: Wave Soldering

Over the years, best practices have evolved and will continue to evolve with the changing environments, company needs and challenges and what may work for one company may not necessarily be best for another. This article offers recommendations to consider in managing your wave soldering process.

The Impact of Industry Regulations on Your Supply Chain

Changes and updates to existing legislation is an ongoing process, and the introduction of new rules is inevitable. It is vital that your EMS partner is committed to staying up to date and to keeping you informed of how these changes may impact your the manufacturing supply chain.


Use of Lean Manufacturing Principles Enhances Quality and Productivity

Using work-cell-based batch assembly processes will enable EMS firms to provide greater flexibility and responsiveness to their box build customers. Here's an example of why this flexibility is important, and find out how regional EMS providers, often thought of as companies primarily focused on PCBA assembly and cellular box builds, who are skilled in mechanical assembly can easily shift to higher-volume work.

KYZEN: Cleaning with Data

With the ability to monitor the temperature and concentration of the bath, and automatically adjust either if needed, the KYZEN Analyst system has caught the attention of the electronics assembly industry. In this interview with I-Connect007, Tom Forsythe, executive vice president for KYZEN, provides an update on KYZEN Analyst and describes how it has evolved into an Internet 4.0 solution with the ability to increase performance and life of the chemistry.

Full Material Declarations: Removing Barriers to Environmental Data Reporting

Full material declaration of product content in electronics and other industries continues to be a challenge for both suppliers and customers alike. This article focuses on requirements for tools that enable rapid and accurate reporting of Class D FMDs that can be used by suppliers primarily in the base of the supply chain.

Demand Forecasting: The Art of Knowing What You Need Before You Need It

Forecasting is a skill born out of experience, intuition, and most of all, knowledge. But what do you need to know when you’re creating an accurate demand forecast? What data is needed? Are there tools you can use? Where do you start? Find out here.

5 Supply Chain Questions to Ask Your Assembly Partner

A key question for any OEM who may be considering outsourcing production is whether to maintain its existing supply chain or to hand those crucial purchasing decisions over to its assembly partner. This article highlights five questions to ask a potential assembly partner before handing over the responsibility for your supply chain management.

Cross Functional Teams Drive Strong Focus on Risk Mitigation and Quality

Having a traditional cross-functional team (CFT) approach, with a much larger CFT group that includes a tactically focused program manager, a strategically focused account director, a buyer, a product engineer, a process engineer, a test engineer, a quality engineer, a production supervisor or lead person, and a customer service representative focused on materials and scheduling, will help EMS firms govern all the necessary outputs associated with each customer.

Best Practices to Achieve Zero Defects

To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.

We Have the Best Practice for That

Most best practices have been developed over time, based on the many different experiences that people encounter in the manufacturing line. And it is important to institute these best practices to make sure that your processes will result in outstanding job at the end of the day.

Strategies for Choosing Solder Paste for Successful Electronics Assembly

One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

How Investment in Staff Well-Being Impacts Manufacturing Productivity

As manufacturers seek to address the challenges of increasing efficiency, there's a greater emphasis on the value of high-performance working practices such as Lean manufacturing. But the emphasis on continual quality improvement processes can also have an indirect effect on employee health and well-being. Here's why manufacturers should invest in the well-being of its employees.


Alpha's Revolutionary Approach to Low-Temp Soldering

In an interview with I-Connect007, Morgana Ribas discusses the new technology on low-temperature solder that she has developed at Alpha Assembly Solutions. She also talks about why there is a need for a low-temperature process and the benefits it offers.

Factronix on Cleaning, the Market and More

Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.

AXI 4.0 in a Smart Factory Environment

Outstanding quality is vital to be able to survive the fierce competition between contract manufacturers. Here's how one EMS provider address inspection challenges and board complexities to ensure the quality and reliability of their PCB assemblies.

How DFA Converts Complexity into Freedom for Medical Device Development

The assembly of medical devices comprising electronic and mechanical components has become an increasing challenge as devices grow more complex, functional and compact, and as they undergo increasingly frequent product refresh cycles. Read on to find assembly techniques that will help manufacturers to deliver highly engineered and integrated products.

IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms

Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.

Addressing Temperature Challenges in Flex Circuit Rework

Zen Lee and Michael Gouldsmith of Thermaltronics discuss the challenges of flex circuit assemblies during the rework process, the power-on-demand feature of smarter hand soldering systems, as well as how Curie Point helps operators avoid temperature overshoots during rework.

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.


Conversation with… Vexos: Doing It Right the First Time

Harry Chan, Deputy GM and VP Manufacturing for EMS firm Vexos Shenzhen, is responsible for all aspects of manufacturing through continuous process improvement, production management, and development of manufacturing talent and teams. In an interview with SMT007 Magazine, he shared the challenges when dealing with flexible circuit assemblies, and strategies and techniques to address them.

Plasmatreat on Atmospheric Pressure Plasma

At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Overcoming Growth Challenges

Growth is usually seen by manufacturers as a good thing—a sign of success and a result of hard work. But if this growth isn’t planned for, or the manufacturer can’t react in time, growth can cause the same devastating results as if the business was in decline. This article looks at seven common areas that can cause manufacturers a headache when their business is growing, along with solutions to help ease the pain.

Tackling Reliability Challenges in Low-Temperature Soldering

William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.

Nearing Retirement, Juki's Bob Black Reflects on a Long Career

After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.

ASM Assembly Solutions on CFX

ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.

Reflow Perspectives to Flex Circuit Assemblies

At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.

Is There an End in Sight to the Electronic Components Crisis?

As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

Aegis on CFX and Hermes Efforts

The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.


DFM: Top Ten PCB Concerns

DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.

Tackling the Challenges in Flex Assembly

Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.

High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum

In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.

Dave Bergman on IPC and CFX

The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.

The Value of Site Visits in Selecting Your Electronics Manufacturer

A site visit can be an invaluable exercise in helping you to better understand your electronics manufacturing services (EMS) outsourcing options and to see first-hand the operational capability, procedures and culture of a prospective EMS partner.

West Penn SMTA: New Leadership, Same Commitment

SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.

It’s Time to Retire ROSE Testing

Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.

Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE

At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.

The Michigan SMTA Expo & Tech Forum 2018: A Review

In May, I had the adventure of driving across Michigan to visit the SMTA Michigan Expo & Tech Forum. This well-organized and attended expo and technical forum featured over 75 exhibitors and two interesting presentations. Read on.

DFT Strategy Needed for 5G Assembly

Mathieu Kury of Asteelflash USA Corp. provides an overview of 5G, the opportunities in the market, and how it will impact the electronics manufacturing industry. He also discusses the key challenges from an EMS standpoint and how to become successful when 5G really arrives.


How to Apply for a Graduate Scheme in Manufacturing

There are a whole host of benefits which make graduate schemes within the UK manufacturing industry a popular career choice. You get paid while you train, you gain invaluable on-the-job experience within your chosen sector, you develop a breadth of new technical and business skills and there’s an opportunity to continue your academic studies while you work.

5G: Testing the Future Impact

The impending arrival of 5G is not without its entourage of challenges that will require a different approach in the electronics manufacturing process. One that is already impacting the electronics manufacturers and assemblers is the testing of the devices. Industry analyst firm Occams Business Research Consulting expects the global 5G network infrastructure market to register a 70% CAGR from 2016 to 2023 and reach up to $28 billion by the end of the forecast period. North America is the leading market for 5G network.

Enabling an Intelligent Supply Chain for Electronics Manufacturing

The first three industrial revolutions came about because of mechanization, electricity and IT. Now, with the advent of the Industrial Internet of Things (IIoT) and services making their way into the manufacturing environment, we are seeing the arrival of a fourth industrial revolution, Industry 4.0.

Key Insights from the Annual Manufacturing Report 2018

UK Manufacturing would appear to be experiencing both an exciting and a disconcerting time, according to the findings of the Annual Manufacturing Report 2018. This year's report set out not just to provide a statistical snapshot of the industry, but to test the mood of manufacturers across a range of issues from technology to training.

Newbie in North Carolina: Local SMTA Event

I-Connect007's Jonathan Zinski attended the SMTA Carolinas Expo and Tech Forum on May 15. Featuring numerous local companies who do not do not always attend larger trade shows, the event offered great value, with its smaller environment contributing to more in-depth conversations.

5G Requires a New Approach to Testing

The industry will be deploying 5G at millimeter wave frequencies between 28 and 40GHz, with significantly wider bandwidths than the current instrumentation. And the rules about how you design a test fixture, or conduct testing of those products is changing. In this article, National Instrument's David Hall explains.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Why Cleaning Still Matters

Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.

The Value of a Global Sourcing Partner

In today's highly competitive environment, global sourcing is no longer a competitive strategy; it is a standard practice. But the challenges of developing a robust domestic PCB supply chain is daunting enough that moving onto the international stage presents a whole new degree of difficulty that most companies are not equipped to manage.

Conversation with… Keysight: Challenges and Opportunities in Testing 5G

Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.


The Key to Boosting Numbers of Women in Manufacturing

According to latest figures by the Office for National Statistics (ONS), the split between male and female employees in UK's manufacturing industry is significant—with men accounting for 76% of the total manufacturing workforce and women making up just 24%. So, what exactly is being done to encourage the recruitment, and retention, of more women within the UK manufacturing environment?

Modeling an SMT Line to Improve Throughput

One of the major challenges for an electronics assembly manufacturing engineer is determining how an SMT machine will impact throughput. Typically, an SMT equipment supplier will ask for a few products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high-mix, low-volume environment, he may need to know the impact of a new machine on 1,000 or more products.

Elements to Consider on BGA Assembly Process Capability

As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.

8 Terms Commonly Used When Buying Electronic Components

As a buyer of electronic components, I've taken for granted just how many terms are used on a daily basis during the procurement process. Here's a quick guide explaining what some of the more common terms used when buying electronic components actually mean.

LPKF Sees Increasing Use of UV Lasers

Julian Rose, product manager for the UV and stencil laser machines of LPKF, discusses with I-Connect007 Managing Editor Stephen Las Marias the challenges in laser stencils and strategies and techniques to address them, and the increasing use of UV lasers.

Launching a Manufacturing Career Via an Apprenticeship

Deciding on the right career path within manufacturing, and the best route to take to make those dreams a reality, can sometimes seem a daunting prospect for young people considering their options. Joining apprenticeships combine the opportunity for on-the-job training with classroom learning, but exactly what you learn depends on the role you're training for.

RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields

At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.

The Survey Said: Industry Optimistic After Strong 2017

During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.

3D Printing and Additive Manufacturing in PCBA

There are several materials that are available for 3D printing for various engineering uses. Various vendors offer over hundreds of different materials that are either specific to an application or to a specific desired characteristic. For this study, eight materials that are regularly used for engineering applications were evaluated and characterized to determine which can be used in PCB processes.


RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared

Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

Combining Strengths Synergistically: PDS and Green Circuits

Power Design Services (PDS) and Green Circuits have just announced their merger. I-Connect007 Publisher Barry Matties recently sat down with Joe O’Neil and Matthew Becker of PDS, along with Ted Park of Green Circuits, to get the full scoop.

RTW IPC APEX EXPO: Inspection Technology Developments

Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.

Under the Hood: Solder Joint Reliability

It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

RTW IPC APEX EXPO: Koh Young Discusses New Equipment and Data Challenges

Joel Scutchfield, Americas Sales Manager for Koh Young, discusses the company's latest inspection equipment and some of the challenges of providing customers the data they need for the real achievement of smart factory realization.

How to Secure a Place on an Electronics Manufacturing Graduate Scheme

The world of EMS is a fast-moving and technologically innovative sector that can offer a wide range of compelling career opportunities for new graduates. For those seeking a route into the electronics manufacturing industry, a graduate scheme can be hugely beneficial in gaining practical, first-hand experience of an EMS business across all its operations.

Zestron Opens Technical Center in Taiwan

Zestron on Wednesday, May 16, launched a new technical center in Hsinchu, Taiwan. With the opening of this new technical center, the company now owns a total of eight globally linked technical support facilities throughout the world.

RTW IPC APEX EXPO: Michael Ford Speaks About Aegis' Role in CFX

At the recent IPC APEX EXPO 2018 trade show in San Diego, California, Michael Ford, European marketing director, discusses his work with Aegis Software and the reaction of attendees who witnessed the Connected Factory Exchange (CFX) demo.

RTW NEPCON CHINA: Mycronic Discusses Recent Acquisitions

At the recent NEPCON China 2018 event, Thomas Stetter, senior vice president for assembly solutions at Mycronic AB, speaks about the company's recent acquisitions and how it helped the company expand into different areas in the electronics assembly industry.

RTW NEPCON CHINA: OK International Highlights Need for Smarter Systems

At the recent NEPCON China 2018 tradeshow in Shanghai, Steven Fang, director of sales for Asia at OK International, speaks about the challenges their customers face when it comes to hiring skilled operators, which warrants the need for smarter systems and tools.


System-Driven Approach Ensures Automotive Electronics Assembly Success

In an interview with SMT007 Magazine, Mathieu Kury, business development manager at Asteelflash USA Corp., talks about the new challenges and customer requirements when it comes to automotive electronics assembly, trends driving the growth of the market, and where the industry is headed.

On Globalization and Standards

Like a language—English, Chinese, Hindi, German, Spanish, French—a standard builds a bridge between people. "If I make this sound, we both understand that it means this. If I write this symbol, we both understand that means that. If I perform this action, we both understand the gesture."

RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding

At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.

Vehicle Electrification: Disrupting the Automotive Industry and Beyond

Around the globe, governments are announcing mandates that will bring about the demise of the internal combustion engine. China has led the charge by requiring 8% of new vehicles on the road to be “new energy” or zero emission vehicles in 2018, up from the current 2–3% on the road today. Similar strong government regulations limiting the future of the internal combustion engine have passed around the world, and the importance and growth of the hybrid and fully electric automobile industry can’t be overstated.

RTW IPC APEX EXPO: Heraeus Discusses Developments at New Lab

Jim Wertin, technical sales manager at Heraeus Electronics, shares news about the company's latest product offerings, as well as its newly established application laboratory, which helps customers and potential customers resolve production issues and improve the quality of their products.

CFX: The Next Step Toward the Future of Factories

For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.

Electronic Component Shortages are Real

The electronic component market is in poor shape (again) and the sooner you face this fact, the sooner you can put plans in place to mitigate the risk to your business. Electronic component shortages are once again causing OEMs and EMS providers a real headache. Here's a look at the current state of the market, and seven ways in which you can work closely with your EMS provider to make the best out of a bad situation.

How the Factory Ecosystem Positively Drives Exponential Value

In today's factories, the output must far exceed the accumulative performance of each machine to stay competitive. No machine or process is an island—they must form ecosystems. The trend towards extreme automation and the smart factory leads to ever more connectivity and interdependence.

What's the Scoop? APEX CFX Showcase

The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.

SMT Renting: A Trend for the Future?

You may have heard the name Martin Ziehbrunner before: he cofounded the equipment company Essemtec AG in 1992. He left the company in 2013, and soon he'd cofounded another SMT company, but with a twist. SMT Renting specializes in renting SMT equipment with an operational lease, primarily for the European market. In this interview, he explains how his latest company is challenging the normal way of acquiring SMT capital equipment.


Solving Reliability and Thermal Management Challenges in Automotive Electronics

Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

The Climate Change of Data

From a typical manufacturing standpoint, cloud storage is simply another way or place in which to put data. From a usage perspective, many see it as being no different from an on-site server or even the external hard disk on your laptop. Off-site cloud storage is vast and can easily be cost effective, requiring no maintenance or fixed overhead other than paying the service bills. There are, however, a couple of very important things to consider with cloud storage.

Poor Supply Chain Management Will Cost You Money

Supply chain management goes far beyond merely keeping track of all the SKUs currently on sale. It also means tracking the parts going into the products, since those parts are also potentially going to be used for post-sale support if necessary. If you can't trust your components to be legitimate and trustworthy, backed by a solid chain-of-possession, then every aspect of your electronics operation may be in jeopardy.

Industry 4.0 Concerns

The fastest way for manufacturers to achieve growth in a new world of industrial connectivity is to leverage new technologies. A transition to automated data and process management is irrefutable. But, while this heralds smart supply chains that bring enhanced agility, productivity and profitability, many are adopting a "wait and see" approach.

RTW IPC APEX EXPO: Mycronic Broadens Product Portfolio

Thomas Stetter, senior vice president of assembly at Mycronic, discussed with I-Connect007's Pete Starkey how their company continues to broaden their product portfolio towards a full-line SMT solution and the Industry 4.0 automated factory.

RTW IPC APEX EXPO: MEK on Increasing Demand for THT AOI Systems

Henk Biemans, managing director of MEK Marantz Electronics Ltd, speaks with I-Connect007 Managing Editor Stephen Las Marias about what's driving the increasing demand for THT AOI systems. Other topics discussed include reliability issues, articifial intelligence, and machine learning in inspection systems.

RTW IPC APEX EXPO: Nordson SELECT's Acquisition Update

Carlos E. Bouras, general manager of Nordson SELECT, discusses the acquisition of ACE Production Technologies and InterSelect GmbH one year later, along with the synergies between the two companies, and how they have strengthened Nordson SELECT's capabilities.

RTW IPC APEX EXPO: CFX - The IPC Connected Factory Initiative

David Bergman from the IPC speaks with I-Connect007's Pete Starkey about how the CFX format has been developed, and the excited response to the CFX Visitor Experience at the IPC APEX EXPO 2018.

5 Ideas to Enhance the Induction Process in Manufacturing

While most of us work and live in an alternate reality, first impressions still count and your induction process is no different. Here are some ideas to consider implementing within your own manufacturing business when welcoming your new starters.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.


Interview with Yusaku Kono: Rising Star Award Recipient

The IPC Rising Star Award is given to IPC members who have taken leadership roles and provided support to IPC standards, education, advocacy and solutions to industry challenges. Their contributions have made significant impact upon IPC and industry within the past five years and will continue to have a lasting impact for many years to come.

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

How to Assess Top Talent when Recruiting for Key Manufacturing Roles

As your business continues to grow and evolve, gaps in talent can start to appear. And while growth is often seen as a sign of success, if you fail to manage growth correctly, it can quickly turn and bite you in a similar way to a business in decline.

RTW IPC APEX EXPO: Super Dry Tackles International Moisture Management Differences and Floor-Life-Reset Techniques

Rich Heimsch comments on the differences in attitude regarding moisture management between Europe and the U.S., and the increasing awareness of floor-life-reset techniques.

The Direction of Autonomous Driving

Flex (formerly Flextronics) is a company that I've worked with for decades, both as a customer and as a supplier. Recently, they were honored with Frost & Sullivan’s Manufacturing Leadership Award. I sat down with Eric Hoarau, the senior director managing automotive innovation at Flex, to discuss his company’s views on where autonomous driving technology is heading in the next 10 - 15 years.

Automotive Electronics Still in the Driver’s Seat

The past year was one of the strongest years that the PCB supply chain and the rest of the electronics manufacturing industry in general, has seen. Everyone we talked to at the shows were optimistic that the strong growth in the industry in 2017 will continue through 2018. And most industry players point to one thing when it comes to what’s driving this strong growth—automotive electronics.

Creative Electron's Bill Cardoso on the iPhone 10 Teardown and Much More

At the recent West Penn SMTA Expo, Creative Electron CEO Bill Cardoso speaks with Patty Goldman about his presentation on the iPhone 10 teardown, and how this reflects the direction where contract manufacturers are headed. He also highlights what sets Creative Electron apart in the market.

The Evolution of Camtek Manufacturing

Chris Davis, president and founder of EMS firm Camtek Manufacturing, in Bloomington, Illinois, discusses with Dan Beaulieu what led her to not only start Camtek from the ground up, but also what it means for her business to be a certified women's business enterprise (WBE).

Interview with Bob Cooke: IPC President’s Award Recipient

IPC first began presenting the President’s Award in 1966, and for many years it was the only award bestowed on IPC volunteers, to several individuals each year. This year’s recipient is Bob Cooke with NASA’s Johnson Space Center (JSC). Here's why he was bestowed this honor.


Why AOI is a Must-have for PCB Assembly

AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.

Interview with Linda Woody: Dieter Bergman IPC Fellowship Award Recipient

The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. This year, Linda Woody is one of the two recipients of the award. Here's what she has to say.

Interview with Dave Hillman: IPC’s 2018 Raymond E. Pritchard Hall of Fame Award Winner

A self-described "dinosaur" of the industry, Dave Hillman has been a steady force in all things solder-related at Rockwell Collins for 30 years. And just to keep things fresh, he has spent years mentoring both college-age and younger children. In this interview, I-Connect007’s Patty Goldman gives Hillman a chance to tell his story.

IPC APEX EXPO Takeaways

The IPC Connected Factory Exchange (CFX) live demo at this year's IPC APEX EXPO show in San Diego, California highlighted how the CFX standard will enable manufacturers to track their efficiencies better, prevent issues even before they happen, and make adjustments wherever needed.

RTW IPC APEX EXPO: Miraco Company and Services Introduction

Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.

Should You Outsource Your Outbound Logistics to Your EMS Partner?

Shipping your products to their end destination is the final stage in your manufacturing process and one which is crucial to the ongoing success of your entire manufacturing operation. After all, getting your product delivered on time, in the correct quantities, to the right people and in pristine condition all contributes to your customer’s first impression.

RTW IPC APEX EXPO: New Electrolube Developments and Improved Coatings

Electrolube's Phil Kinner discusses new developments in two-component polyurethane conformal coatings, and improved silicone coatings for high-temperature applications.

RTW IPC APEX EXPO: Kyzen’s Tom Forsythe Talks Tips for Better Cleaning

Tom Forsythe, executive VP of KYZEN, offers his advice on designing for better cleaning. Forsythe also discusses customers' continuing demand for data and KYZEN's data management efforts.

RTW IPC APEX EXPO: Blackfox—Training Program for Transitioning Military Personnel

Al Dill, president and CEO, discusses a training program for transitioning military personnel provided by Blackfox, who is a certified IPC training organization around the world.

Industry 4.0 Technologies: If Only I Had Known

What is coming in 2018 is not a single master Industry 4.0 solution as people may expect, but rather the opportunity for everyone in the industry to play their part, re-evaluating what can be done in their processes or products to take maximum advantage of the new CFX-fueled Industrial IoT environment.


RTW IPC APEX EXPO: Saki—The Smart Factory Concept

Alex Malek, VP of sales and service for Saki, explains how the company's software and hardware provide a common platform for machine-to-machine interconnectivity.

RTW IPC APEX EXPO: Manncorp Expands With New Learning Center

Ed Stone, sales manager of Manncorp, discusses the company's expansion, specifically their new application and learning center, their new equipment in the pipeline, and his outlook for this year.

RTW IPC APEX EXPO: Zentech Discusses New NIST Legislation

Matt Turpin, president and CEO of EMS firm Zentech Manufacturing Inc., speaks about the NIST 800-171 legislation published by the National Institute of Standards and Technology, and how it is different from other regulations such as ITAR.

Cleaning with Data

Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.

5 Techniques Used to Detect Counterfeit Electronic Components

Although government pressure and private resources have helped minimize the risk of counterfeit components from entering the supply chain, there is still and will most likely continue to be, a prominent threat. So, what can you do to minimize this risk? Read on.

RTW IPC APEX EXPO: Kimball Electronics Discusses New Opportunities in the Medical Market

Tom Ferris, business development director for Kimball Electronics' medical industry solutions business, discusses the latest opportunities in the medical market and new requirements from customers.

A Not So Surprising Focus for Flex in the XR Realm

Dan Feinberg has been covering augmented, virtual, and mixed-reality for I-Connect007 for the last few years. He recently met with Eric Braddom, VP of Extended Reality (XR) Product Management for Flex, a company that is involved in this disruptive technology. In this interview, Dan and Eric discuss the future of augmented, mixed and/or virtual reality, or as Flex calls it, "extended reality."

Electronics Manufacturing (R)evolution

2018 is going to be the year of Industry 4.0, where we will see how enabling technologies including sensors, big data, analytics, and the Internet of Things (IoT), will transform the electronics manufacturing landscape.

RTW IPC APEX EXPO: COMET Technologies Highlights Product Range and New Facility

Craig Arcuri of COMET Technologies details the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley.

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.


Your Competitors are Outsourcing Their Manufacturing; Shouldn’t You?

As an OEM, you will be focused on increasing sales and maximizing profits. But you can only sell what you can produce, and manufacturing complex industrial electronic products day in, day out can be a headache. As your sales start to climb, you move closer to hitting your internal capacity limits. Here's how EMS providers can help you become successful in your manufacturing.

RTW IPC APEX EXPO: How Smart Factories Will Revolutionize Electronics Manufacturing

KIC president Bjorn Dahle discusses the smart manufacturing trend in the electronics assembly industry, and how KIC can help their customers with smart manufacturing transitions.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

Setting Clear Boundaries with Your EMS Provider

A common area for confusion, particularly during the early stages of an outsourcing partnership, relates to 'boundaries', and agreeing who is responsible for what. If clear lines are not discussed and agreed between you and your EMS provider, it can be easy to fall into an assumption trap, and we all know what happens then.

RTW IPC APEX EXPO: Addressing Challenges in Automotive Electronics

Paul Salerno explains how Alpha Assembly Solutions have addressed the challenges of the exponential growth in automotive electronics, with specific reference to soldering in power train, ADAS, and infotainment applications

RTW IPC APEX EXPO: Asteelflash Expansion Plans and Industry Challenges

Mathieu Kury, business development manager at EMS firm Asteelflash, discusses the company's expansion plans and activities amid the growing demand in the automotive electronics space.

RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys

Tim O'Neill explains developments in solder alloys for cost-sensitive applications, and improvements in the reliability of alloys subjected to sustained high temperatures.

RTW IPC APEX EXPO: IPC Highlights Latest Developments in EDGE

David Hernandez, senior director of learning and professional development at IPC, speaks with editor Stephen Las Marias about talent recruitment and retention, skills gap challenges facing the industry, and how IPC is addressing these issue through its IPC EDGE platform. Hernandez also discusses the latest developments in EDGE and how IPC is expanding the program.

Exceeding Customer Expectations

Aculon Inc. commercializes unique surface coatings leveraging nanotechnology and other surface modification techniques. The company’s original focus was the optical industry, developing treatments of prescription eyewear, sunglasses and other optics.

The IoT Event of The Decade

The IPC APEX EXPO tradeshow at the end of this month is set to rock the manufacturing world in a way that has not been seen for many years. This is not just a tech-fest, it is the introduction of some serious business growth opportunities for manufacturers, machines vendors and solution providers based on the successful implementation of their Industry 4.0 solutions and enhancements.


The Vital Role of Solder Paste Printing in New Product Introduction

The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.

Dr. Bill Cardoso of Creative Electron Talks About IPC’s CFX Standard

Creative Electron's Dr. Bill Cardoso is a member of the CFX committee and has equipment in the CFX showcase at APEX in San Diego from February 27 to March 1. In an interview, he talks about the standard and the group that has delivered such a successful collaboration.

Mycronic Announces the Acquisition of Vi TECHNOLOGY

Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.

9 Essentials of an Electronics Contract Manufacturer

Differentiating between the best contract electronics manufacturing providers and those that are sub-par can initially seem tricky. In order to help you make the best and most educated decision possible, here are nine essentials to look for when hiring an electronics manufacturing service.

Working with Customers: A Consultant's Perspective

Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

6 Questions to Assess Your Company's IoT Readiness

Small-to-medium sized companies shouldn't assume that Industrial Internet of Things (IIoT or Industrial Internet) is for the 'big boys' only. Innovations coming out of the IIoT have the potential to significantly level the playing field among companies of all sizes.

Start Your IPC APEX EXPO Show Experience Here

As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!

Why the Right Preparation is Crucial for Your NPI

In today's increasingly competitive manufacturing environment, it's crucial that you are able to produce high quality new products that can be delivered on time, at the volumes required and at the right cost. And the key to ensuring a smooth transition from the initial design through to final manufacture is the implementation of a new product introduction (NPI) process.

Improving SMT Yield and Reducing Defects: A Rauland Case Study

Ever-increasing demand for more complex boards that have higher densities of components means more challenges for SMT assembly operations and yields. Smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. These advancements have spurred a new set of challenges in building smaller and more complex assemblies.

Growing with the Customer

Greg Hebson, global director for strategic accounts at EMS firm Vexos Inc., speaks with I-Connect007's Stephen Las Marias about working closely and growing with customers, as well as ensuring total customer satisfaction.


Designing Electronics for Harsh Conditions

We expect a lot from our products, especially our electronic products. Think about it: cellphones, wearables, medical devices—for some reason we think they should still work after being immersed in liquid, left outdoors in freezing temperatures or dropped on concrete from a standing position.

Talk to Your Customers

Whatever industry we are in, we are a customer and a supplier at the same time. The goal is always 100% customer satisfaction, as dissatisfaction in your customer side will eventually result in problems. For one, according to the results of our survey, the loss of business and reputation can be the consequences of not meeting your customers' needs.

Pros and Cons of Outsourcing Your Product Design to an Independent Contractor

Taking on an independent design contractor or sole trader offers an opportunity to inject a fresh perspective, to gain the value of specialist knowledge and to save on staffing costs, training, infrastructure and equipment. Ultimately though, deciding whether to engage an independent contractor in your product design will require weighing up the pros and cons as they apply to your specific project.

Super Dry’s Novel Approach to the Drying Process

Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.

Why You Should Invest In Package Testing

Have you ever thought about why you should invest in package testing? Packaged products often take multiple modes of transportation in various conditions before they ever reach the customer. The best way to ensure the product makes it to the customer, intact and in working order, is to test the package before it ever leaves the manufacturing facility.

Tips & Tricks: Machine Assist Time

Assist time is the human intervention required to keep a machine producing during normal operation. It does not include errors, maintenance, setup, and prototyping. There are many reasons for a machine to require assistance. PCB loading, stencil wiping, paste addition, feeder replenishment, and PCBA unloading—some require labor, some can be automated, but all will require some amount of time to complete.

Should You Be Outsourcing Product Design?

While handing over part or all of your manufacturing to a third party can be daunting, it offers a host of benefits. It frees you up to focus on what you do best--whether that's designing, marketing or selling. It reduces your operating costs, and you gain from the range and depth of expertise than an EMS can provide. For OEMs already outsourcing their manufacturing, going to a third party for other services, like product design, could well be the next logical step.

Tempo Automation: Setting the Pace for Low-Volume, Quick-Turn Assembly

Jesse Koenig, co-founder and VP of technology at PCB assembly company Tempo Automation, discusses with I-Connect007's Patty Goldman how they are making electronics development much easier and more seamless for customers.

The Importance of Feedback in the Electronics Assembly Supply Chain

Any customer feedback is a good feedback, whether it is good or bad, because it often pushes the supplier or manufacturer to improve. However, the problem in the electronics assembly supply chain is that customers often do not give feedback, unless it is negative.

Working with Your Customers

Even though you have trusted supplier partners, working closely with them will ensure seamless manufacture and high-quality output. In our recent survey, most of our respondents agree, with more than a third or 40% closely working with at least 50% of their customers.


What's Driving Manufacturing Investment in 4IR?

The use of automation is transforming global manufacturing, with initiatives such as robot technology, big data and 3D printing, providing manufacturers with the ability to create smarter products, more streamlined processes and better solutions for their customers.

Making the Right Equipment Selection

For the January 2018 issue of SMT007 Magazine, we invited Kathy Nargi-Toth, president of Eltek USA, and Matt Turpin, president and CEO of Zentech Manufacturing to a discussion on the decision-making process for new equipment, and the key considerations for choosing the best machine solution for a process.

Selecting X-Ray Inspection Equipment

Automated optical inspection (AOI) is an established, key process control in the SMT industry that greatly increases confidence in the quality of the finished product. But what do you do about devices where you cannot optically see the solder connections? X-ray inspection provides the answer.

How Engineering Support Can Affect QC

Quality processes are part of any reputable contract manufacturer's operation. When working with an electronics contract manufacturer, it is wise to consider a partner that has an experienced engineering team. This article tells more.

Indium's Karthik Vijay Talks Engineering for Automotive Applications

Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.

Creating a Healthy Work Environment

In an interview with SMT007 Magazine, Wolfgang Koehler, CEO of the North America branch of ULT, discusses how their business has been over the past year, their challenges and opportunities, and how they are helping their customers. Another topic of discussion is investing in new equipment—the key parameters to consider, and what’s driving customers to buy their systems.

7 Simple Ways to Motivate Your Electronics Manufacturing Staff

Your manufacturing staff are the backbone of your electronics manufacturing organization. They are the ones showing up day in. day out to build products for your customers. So, keeping them motivated and engaged should be a priority, right? But too often during peak production periods, surmounting pressure can lead to staff feeling overworked, demoralized, and underappreciated.

The Importance of Product Testing for Quality, Reliability and Durability

One really vital piece of the product development process is product testing for quality, reliability and durability. You need to find out whether your product will do what it's supposed to do—that's quality. You also need to learn whether it will do what it's supposed to do over and over again, even when conditions aren't ideal—that's reliability and durability.

Assigning IDs Within the Internet of Things

Networking devices and machinery is in full swing. However, despite all the Industry 4.0 enthusiasm, there are voices of caution: Secure your communication. For this, identification of the participants is one requirement and special SD cards offer a surprisingly simple and flexible solution.

Improving Design, Manufacturing and Assembly Teamwork

Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.


Tips & Tricks: Assembly Panelization

Thoughtful PCB array and panel design can reduce line stoppage, improve changeover time and reduce material scrap. Fiducial location and design are good aids to prevent mistakes, but may still result in line stoppage. If you have fiducial recognition issues, making the shape of the mask opening different than the fiducial feature may help the vision system discern the target feature easier.

Is UK Manufacturing Ready for the Fourth Industrial Revolution?

The new fourth Industrial Revolution (4IR) is driving the transformation of manufacturing across the world, encompassing breakthroughs in artificial intelligence, big data, the Internet of Things and 3D printing. And according to the World Economic Forum's Klaus Schwab, when compared with previous industrial revolutions, the fourth is evolving at an exponential rather than a linear pace.

Recent Innovations in DFMA

Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.

Configure to Order: Different by Design

When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

PCB Pad Repair Techniques

There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Focus on the New

It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.

Why You Want Your EMS Partner to Be Annoying and Boring

Outsourcing part or all of your manufacturing to an electronics manufacturing service (EMS) provider can be daunting. Handing over some of the control of your business can be a scary prospect.

14 Lessons in Diagnostic Instrument Development

With over 40 years of global leadership in the design, development and manufacture of life-saving medical technology, ITL Group offers invaluable experience and industry insight into what influences the success or failure of a product. Here are 14 lessons from ITL’s many years in diagnostic instrument development.

Top 10 Most-Read SMT007 Columns of 2017

Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

What Does Digital Twinning Mean for Manufacturing?

Industry 4.0 brings with it new forms of artificial intelligence that organizations can leverage to improve and streamline their processes. Machine intelligence is driving industrial connectivity and possibilities for optimized productivity and in turn, substantial savings.


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