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SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce

04/18/2024 | SEMI
The SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.

RTX Recognized as JUST 100 Company

02/06/2024 | RTX
RTX was named one of America's Most JUST Companies, for the third consecutive year, for its commitment to serving its workers, customers, communities, the environment and shareholders. RTX ranked No. 1 in the aerospace and defense sector and No. 69 overall in the JUST 100.

Aegis Software & Arch Systems Partner to Digitize Continuous Improvement in Manufacturing

12/12/2023 | Aegis Software
Aegis Software, a global provider of Manufacturing Operations Management Software (MOM/MES), and Arch Systems, the leading provider of data and analytics for manufacturing operations, announce a groundbreaking partnership toward digitizing continuous improvement of factory operations.

Manufacturers Anticipate Completion of NVIDIA’s HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026

11/28/2023 | TrendForce
TrendForce’s latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 (24GB) is anticipated to complete verification with NVIDIA by December this year.

Cutting-edge Inspection Challenges

09/26/2023 | Brent Fischthal, Koh Young America
Koh Young’s Brent Fischthal explains how UHDI and advanced packaging are challenging inspection systems. He says the shift toward larger components and advanced packaging brings a host of challenges that impact the industry. These challenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach.
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