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Key Tronic Announces Results for Q3 of Fiscal Year 2024

05/08/2024 | Globe Newswire
For the third quarter of fiscal year 2024, Key Tronic reported total revenue of $140.5 million, compared to $164.6 million in the same period of fiscal year 2023.

Global Sourcing Spotlight: Golf, Friedman, and the Benefits of Global Sourcing

05/08/2024 | Bob Duke -- Column: Global Sourcing Spotlight
When I started working on global sourcing for American Standard Circuits, a friend sent me a book by the NY Times economist Thomas Friedman called The Lexis and the Olive Tree. Well, not being a fan of the NYT or even economists as a whole, I put the book on a shelf and forgot about it until I got a call from my book-giving friend, and he asked me what I thought of the book. I mumbled something unintelligible and quickly changed the subject.

Fabrinet Announces Q3 Fiscal Year 2024 Financial Results

05/07/2024 | Fabrinet
Fabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, today announced its financial results for its third fiscal quarter ended March 29, 2024.

Nolan’s Notes: Coming to Terms With AI

05/07/2024 | Nolan Johnson -- Column: Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
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