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TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

CACI Awarded $1.3 Billion Task Order to Provide Communications and Information Technology Expertise

04/26/2024 | CACI International Inc.
CACI International Inc announced that it has been awarded a five-year task order worth a total estimated value of $1.3 billion to provide communications and information technology expertise to U.S. European Command (USEUCOM) and U.S. Africa Command (USAFRICOM).

Intel Gaudi, Xeon and AI PC Accelerate Meta Llama 3 GenAI Workloads

04/22/2024 | Intel Corporation
Meta launched Meta Llama 3, its next-generation large language model (LLM). Effective on launch day, Intel has validated its AI product portfolio for the first Llama 3 8B and 70B models across Intel® Gaudi® accelerators, Intel® Xeon® processors, Intel® Core™ Ultra processors and Intel® Arc™ graphics.

Cadence Unveils Palladium Z3 and Protium X3 Systems

04/18/2024 | Cadence Design Systems
The Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.

IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products

04/18/2024 | PRNewswire
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
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