Nolan’s Notes: Tariffs, Technologies, and Optimization
Global Sourcing Spotlight: Finding the Balance Between Cost and Quality
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Circuit Technology Center Expands Robotic Tinning Capacity with Two Additional Hentec/RPS Odyssey 1325 Machines
October 3, 2025 | Circuit Technology CenterEstimated reading time: 1 minute
Circuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce the addition of two new Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machines to its production floor. This expansion increases the company's total robotic tinning capacity to six machines, significantly boosting throughput for high-reliability applications.
The Odyssey 1325 is a MIL-spec compliant, high-volume, high-mix lead tinning system equipped with auto load/unload functionality and capable of processing dual solder alloys. Designed for component lead reconditioning, gold removal, and re-tinning, it supports a wide range of component types, including DIP, SIP, QFP, BGA, axial, and radial components, as well as BGA de-balling. Each machine complies with GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E, and ANSI-J-STD-002 standards.
"This investment strengthens our ability to deliver fast-turn, high-reliability tinning services to our commercial, medical, aerospace, and military customers' said Jeff Ferry, President of Circuit Technology Center. By doubling down on robotic automation, we’re ensuring unmatched consistency, compliance, and capacity for the most demanding applications."
With six Odyssey 1325 systems in operation, Circuit Technology Center reinforces its position as one of the most capable and responsive component lead tinning providers in the industry.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
Capital Electro-Circuits Achieves ITAR Registration to Strengthen Aerospace and Defense Capabilities
10/06/2025 | Capital Electro-CircuitsCapital Electro-Circuits, Inc. (CEC), a U.S.-based manufacturer of mission-critical printed circuit boards since 1985, announced that it is now officially registered with the U.S. Department of State, Directorate of Defense Trade Controls (DDTC) under the International Traffic in Arms Regulations (ITAR).
Elephantech's SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens
10/06/2025 | ElephantechElephantech Inc. is pleased to announce that its proprietary flexible printed circuits (FPCs) have been adopted for mass production by OM Digital Solutions Corporation in the company’s latest flagship products.
Taiwan PCB Industry Projects NT$915.7 Billion Output in 2025, Driven by AI Demand
10/03/2025 | TPCATaiwan's PCB manufacturing output is projected to reach NT$218.2 billion in the second quarter of 2025, a 14.4% increase over the same period in 2024.
PCB West 2025 Showcases Success: An Interview with Mike Buetow
10/03/2025 | Marcy LaRont, I-Connect007For more than 30 years, PCB West has served the PCB and design industries in Silicon Valley, bringing together engineers, fabricators, and designers for technical sessions and networking. The show is organized by the Printed Circuit Engineering Association (PCEA), and this year, PCEA President Mike Buetow was named the association’s first Hall of Fame award recipient. Marcy LaRont spoke with Mike at PCB West to learn firsthand about its origins and mission.