-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
i3 Electronics’ Frank Egitto Wins Lifetime Achievement Award
November 25, 2015 | i3 ElectronicsEstimated reading time: 5 minutes
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.
About S³IP & NYSTAR
S³IP brings together the resources of several organized research initiatives including: the Integrated Electronics Engineering Center (IEEC), a New York State Center of Advanced Technology, known for leading edge research in electronics packaging; the National Science Foundation Industry/University Cooperative Research Center in Energy-Smart Electronic Systems (ES2), developing new dynamic, predictive, and synergistic energy optimization and thermal management design criteria enabling U.S. data centers and electronic systems to operate efficiently and securely; the Center for Autonomous Solar Power (CASP), focused on new energy production and storage technologies; the Center for Advanced Microelectronics Manufacturing (CAMM), a national microelectronics R&D center demonstrating the feasibility of roll-to-roll flexible electronics manufacturing; and the Northeast Center for Chemical Energy Storage (NECCES) , an effort being led by Binghamton University to support basic research in the design of the next generation of lithium-ion batteries (LiBs), which requires both the development of new chemistries and the fundamental understanding of the physical and chemical processes that occur in these complex systems. Underpinning these research initiatives is the Analytical and Diagnostics Laboratory (ADL). NYSTAR’s responsibilities include the administration and oversight of the seven Centers of Excellence (COE) across New York State, including S³IP. The Centers of Excellence Program supports major upgrades of research facilities and other high technology and biotechnology capital projects, allowing colleges, universities and research institutions to secure research funding that will lead to new job creation. NYSTAR defines the mission of S³IP at Binghamton University as “advancing the frontiers of microelectronics research and development, specifically addressing challenges in small scale systems design, development, prototyping, process development and manufacturing for the microelectronics industry.”
Page 2 of 2Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.