-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI
December 14, 2015 | Patty Goldman, I-Connect007Estimated reading time: 8 minutes
Santos: There is none that fits everything. It depends on the application, the end-use environment, which finish you need for a specific application. The talk also mentioned that there should be at least 0.1 micron of metallic tin after the reflow cycle, which is a pre-treatment process that the immersion tin goes through. So, that is exactly my poster: The reflow effect on the immersion tin solder wetting.
We also went to another talk given by George Milad about IPC thickness requirements. He mentioned that for the tin finish to be solderable after two reflow cycles, you need at least one micron of immersion tin to begin with to have free-tin at the end of the reflow cycle, so that it would still be solderable.
Goldman: And your immersion tin achieves that?
Santos: Yes. So, it's comparable to what competitors have.
Nable: This study also contributes to the understanding of how the immersion tin finish changes with thermal exposure. We wanted to dig a little bit deeper into the mechanism of how immersion tin changes.
Goldman: Surface finishes are of interest to the audience here.
Nable: Right. And that's what we do at MacDermid. We both work in the electronics solutions division and our projects particularly are more focused on final finish, surface finish type of projects. But we're not limited to that.
Goldman: Anything else going on?
Nable: I also want to share that I am a volunteer officer for our local chapter in Connecticut for SMTA, so this is really nice to be able to participate in SMTAI and meet people, and meet the other chapter officers as well. This is the international conference, so this is where all chapters might come together.
Santos: Jun is actually the president of the SMTA Connecticut chapter.
Nable: I am. We try to organize activities or meetings that would be of benefit and relevant to our members that we can all learn from. We get ideas from SMTAI, having these technical talks to gauge the current issues and level of interest in certain topics. We try to bring that back to our local chapter because not all of our members can come to SMTAI.
Santos: The venue of previous SMTA Connecticut chapter expo and forum is just five minutes’ walk from our Waterbury, Connecticut site and fairly accessible to all local members.
Page 3 of 4
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.