Program Seeks Ability to Assemble Atom-sized Pieces Into Practical Products
December 30, 2015 | DARPAEstimated reading time: 1 minute
DARPA recently launched its Atoms to Product (A2P) program, with the goal of developing technologies and processes to assemble nanometer-scale pieces—whose dimensions are near the size of atoms—into systems, components, or materials that are at least millimeter-scale in size. At the heart of that goal was a frustrating reality: Many common materials, when fabricated at nanometer-scale, exhibit unique and attractive “atomic-scale” behaviors including quantized current-voltage behavior, dramatically lower melting points and significantly higher specific heats—but they tend to lose these potentially beneficial traits when they are manufactured at larger “product-scale” dimensions, typically on the order of a few centimeters, for integration into devices and systems.
DARPA recently selected 10 performers to tackle this challenge: Zyvex Labs, Richardson, Texas; SRI, Menlo Park, California; Boston University, Boston, Massachusetts; University of Notre Dame, South Bend, Indiana; HRL Laboratories, Malibu, California; PARC, Palo Alto, California; Embody, Norfolk, Virginia; Voxtel, Beaverton, Oregon; Harvard University, Cambridge, Massachusetts; and Draper Laboratory, Cambridge, Massachusetts.
“The ability to assemble atomic-scale pieces into practical components and products is the key to unlocking the full potential of micromachines,” said John Main, DARPA program manager. “The DARPA Atoms to Product Program aims to bring the benefits of microelectronic-style miniaturization to systems and products that combine mechanical, electrical, and chemical processes.”
The program calls for closing the assembly gap in two steps: From atoms to microns and from microns to millimeters. Performers are tasked with addressing one or both of these steps and have been assigned to one of three working groups, each with a distinct focus area.
To view summary descriptions of each performer's planned work within the three working groups click here.
Suggested Items
Sypris Receives New Releases Under Electronic Warfare Program
05/03/2024 | Sypris Electronics LLCSypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has recently received additional releases under a multi-year production contract that was first announced in 2022. The order, which provides for Sypris to begin deliveries in 2024, calls for the manufacture and test of electronic assemblies for an additional four systems to be supplied to a U.S. DOD contractor.
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
GPV’s Q1 2024 Interim Financial Report Shows Strong Navigation in Uncertain Times
05/01/2024 | GPVDanish-based GPV recorded an expected drop in sales to DKK 2.3 billion for the first quarter of 2024. The decline also affected the operating profit, which was DKK 155 million compared to DKK 179 million in the same quarter last year, although the EBITDA margin was maintained. In general, demand has been softer in 2024, but GPV continues to invest for the long-term and expects the trend to turn in the second half of 2024.
Europlacer Presents New Range of iineo SMT Placement Machines.
05/01/2024 | EuroplacerFor more than 15 years, the Europlacer iineo placement machines have made their mark on the SMT industry with unique features and unrivalled flexibility. Today, Europlacer announces the launch of the second generation iineo.