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This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
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SiSoft Announces OptimEye Technology for AMI Simulations
January 20, 2016 | SiSoftEstimated reading time: 3 minutes
SiSoft collaborates with customers and their suppliers to develop innovative solutions to the world’s toughest high-speed design problems. SiSoft accelerates design cycles through a combination of award-winning EDA simulation software, methodology training and consulting services. Quantum Channel Designer (QCD) is the Industry’s Premier Channel Simulator for the design and analysis of Multi-Gigabit serial links and a DesignVision Award Winner. Quantum-SI (QSI) is the leading solution for integrated signal integrity, timing and crosstalk analysis of high-speed parallel interfaces. SiSoft’s products automate comprehensive pre- and post-route analysis of high speed interfaces, detailing a design’s operating voltage and timing margins. More information on SiSoft can be found at www.sisoft.com.
About SiGuys
SiGuys leverages decades of Signal Integrity (SI) experience to provide consulting services to electronic hardware design teams. SiGuys handles all types of SI challenges with particular focus on today’s highest speed serial links, and deploys advanced simulation capabilities to ensure designs work right the first time. SiGuys’ customers receive real data, clear communication, and documented solutions for their most-challenging SI problems. More information on SiGuys can be found at www.siguys.com.
About DesignCon
DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
Page 2 of 2Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.