Reading time ( words)
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider.
He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
Watch the interview here.
Steve Williams, The Right Approach Consulting LLC
Understanding your customers may seem like a no-brainer, but conversations with company leaders across various industries the past five years have demonstrated to me just how difficult this can be in practice.
Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
Stephen Las Marias, I-Connect007
From flex circuits to HDI, Industry 4.0, leading market drivers, and materials—this wide-ranging discussion with Sunshine Global Circuits CTO David Aldape highlights the latest and future developments, challenges, and opportunities in the PCB manufacturing industry.