Uyemura’s New Board Chemistry Allows Direct Plating on Copper


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Uyemura has announced the commercial availability of Talon 3 electroless palladium, a groundbreaking technology in board chemistry that allows plating directly onto copper.  This development effectively paves the way for EPIG – electroless palladium/ immersion gold, a nickel-free alternative that becomes more consequential as lines become tighter and space becomes more critical.  

Talon 3 E-Pd was developed for applications that cannot tolerate nickel for other reasons as well.  These applications are numerous, and fall into four main categories:  medical sensors, where nickel is prohibited for reasons of patient sensitivity; flexible circuits, where there’s a risk of nickel fracturing creating gaps in the circuits; electronic products that cannot use nickel due to problems related to magnetics and frequency, and high frequency circuitry (particularly aerospace) where nickel can compromise signaling. 

Talon 3 deposits an electroless / autocatalytic palladium that is solderable and gold wire bondable. The bath has a low palladium metal content and is highly stable. The rate of deposition and quality of the deposit are consistent throughout the product’s bath life. 

The EPIG finish made possible with Talon 3 electroless palladium solders perfectly after eight hours of steam aging – a significant achievement.  The process was developed by Uyemura’s Tech Center in Southington, CT, one of the industry’s most renowned facilities for the development and testing of board chemistries.

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