-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Conductor Analysis Technologies (CAT) Provides Test Systems to TTM Technologies
April 27, 2017 | TTM TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies (CAT) has announced the sale of two OM Thermal Stress Systems to TTM Technologies, Sterling Virginia. “This is a significant step in the adoption of reflow simulation for bare board acceptance by the industry,” said Tim Estes, Chief Technology Officer at CAT.
The OM Thermal Stress System is a cost-effective performance-based reliability test methodology which performs both convection reflow assembly simulation per IPC TM-650 2.6.27 and air-to-air thermal cycling per IPC TM-650 2.6.7.2. The system is configured to perform 230°C and 260°C reflow simulation, as well as -55° to +125°C thermal cycling.
According to Nick Meeker, Chief Operating Officer at CAT, “We have installed a number of test system at OEMs and test laboratories, however this is the first installation at a printed circuit board manufacturer. The systems are scheduled to be installed and operational by mid-August.”
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards, and by material and equipment suppliers to the printed circuit industry. Our products and services provide quantitative data on printed circuit manufacturing capability, quality, and reliability. For more information, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.