TopLine Exhibiting CCGA, Solder Joint Reliability Solutions at Space Tech Expo


Reading time ( words)

TopLine Corporation will exhibit its innovative CCGA technology and solder joint reliability solutions in booth #8023 at the Space Tech Expo show May 23-25, 2017 in Pasadena, California, USA. Space Tech Expo USA is America’s engineering and manufacturing meeting place for space technology. The show will be held at the Pasadena Convention Center, 300 E. Green St., Pasadena, CA 91101. 

Featured TopLine products will include CCGA - Column Grid Arrays and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. 

CCGAs reduce stress caused by CTE mismatch, thereby increasing reliability of semiconductor components for space, mil/aero, down-hole drilling and special automotive and medical applications. CCGA technology increases life for FPGA (Field Programmable Gate Arrays). CCGAs are better than BGAs for rugged operating environments.

About TopLine

TopLine Corporation is a leading provider of test vehicle components and packaging solutions for Circuit Assemblies. TopLine manufactures CCGA Column Grid Arrays, solder columns, and a wide range of daisy chain semiconductor packages, and offers a complete range of daisy chain test chips for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. TopLine is a one-stop source for all dummy components. For more information, contact TopLine Corporation, Tel (800) 776-9888; Email: sales@TopLine.tv

Share


Suggested Items

The Vital Role of Solder Paste Printing in New Product Introduction

02/22/2018 | Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.

Working with Customers: A Consultant's Perspective

02/19/2018 | Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

SuperDry’s Novel Approach to the Drying Process

02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.



Copyright © 2018 I-Connect007. All rights reserved.