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The June 2017 issue of The PCB Magazine is now available.
Embedded technology seems finally to be coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found in that most ubiquitous of consumer products, the smartphone, as you will learn in this issue. They are truly all around us!
Read all about it this month in The PCB Magazine, now on the virtual newsstand and available for free delivery in your e-mailbox by subscription. Register with my I-Connect007 to manage all of your subscriptions through your own dashboard.
Be sure to download the PDF version to your devices for handy future reference.
I-Connect007 Editorial Team
Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Dan Beaulieu, D.B. Management Group
Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.