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Summit Interconnect Orange Chooses atg A7a for High-speed Electrical Test and Automation
July 31, 2017 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute

Summit Interconnect has installed an atg A7a, an eight-head, double-sided, high-speed auto-load/unload system that provides true “lights-out” operation, at its Orange, California facility.
"The atg A7a will be our highest-speed tester yet, and with the auto-load/unload feature, it will significantly improve productivity on large jobs," said Summit Orange VP and General Manager Jack Evans.
The atg A7a auto-load/unload testers utilize eight flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCBs for continuity and isolation. Board sizes of 24” x 21" or larger with small pad/fine-pitch technology can be tested quickly and easily. Special options, such as, 4-wire Kelvin tests, hi-pot test, latent defect test, and others can be provided.
About Summit Interconnect
Summit Interconnect is a manufacturer of advanced technology custom circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications. Manufacturing services include quick-turn, prototype and production through our two facilities located in Orange County, California.
About atg Luther & Maelzer GmbH
With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
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Brent Fischthal - Koh YoungSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
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20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.