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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Summit Interconnect Orange Chooses atg A7a for High-speed Electrical Test and Automation
July 31, 2017 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
Summit Interconnect has installed an atg A7a, an eight-head, double-sided, high-speed auto-load/unload system that provides true “lights-out” operation, at its Orange, California facility.
"The atg A7a will be our highest-speed tester yet, and with the auto-load/unload feature, it will significantly improve productivity on large jobs," said Summit Orange VP and General Manager Jack Evans.
The atg A7a auto-load/unload testers utilize eight flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCBs for continuity and isolation. Board sizes of 24” x 21" or larger with small pad/fine-pitch technology can be tested quickly and easily. Special options, such as, 4-wire Kelvin tests, hi-pot test, latent defect test, and others can be provided.
About Summit Interconnect
Summit Interconnect is a manufacturer of advanced technology custom circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications. Manufacturing services include quick-turn, prototype and production through our two facilities located in Orange County, California.
About atg Luther & Maelzer GmbH
With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
05/01/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.