Nordson to Demo Revolutionary AOI, AXI and Bondtesting Systems at NEPCON South China


Reading time ( words)

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, will exhibit at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event. They will be in Stand 1H20.

The Nordson DAGE Quadra 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. The 0.35μm feature recognition up to 10W of power, makes the Quadra 5 the leading choice for PCB and semiconductor package inspection.

Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. 

Nordson_MATRIX.jpgNordson MATRIX presents an excellent inline solution with its X#-series systems. This modular automated inspection platform is designed for flexible, high-speed inline X-ray inspection. The platform features up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter- Technique (SFT), Off-Axis technology (2.5D) and 3D SART. The exhibited X2.5# system allows high-speed off-axis image acquisition from different angles and presents a reliable solution for the inline inspection not only of double-sided PCB assemblies but a wide range of various applications (e.g. SMT, Power Hybrid inspection, battery inspection).

Nordson_YESTECH.jpgNordson YESTECH’s FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process. The system inspects for quality and consistency of coating coverage under proprietary ultra violet lighting with the use of proprietary inspection algorithms. An optional coating thickness measurement package also is available.

About Nordson Test and Inspection

Nordson DAGE, MATRIX and YESTECH, units of Nordson Corporation (NASDAQ: NDSN),  manufacture and support a complete range of industry leading Test and Inspection products for the electronics industry. Offering an award winning portfolio of  Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), Manual X-ray Inspection (MXI), Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems, Nordson’s family of Test and Inspection products bring powerful and cost effective solutions to the Printed Circuit Board Assembly (PCBA) and Semiconductor industries.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web, click here.

Share


Suggested Items

Blockchain for Manufacturing: What are the Opportunities?

11/17/2017 | Neil Sharp, JJS Manufacturing
Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?

Is Hybrid Technology Gaining Momentum?

10/02/2017 | Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.

RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing

09/12/2017 | Real Time With... NEPCON South China
During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.



Copyright © 2017 I-Connect007. All rights reserved.