Esse Ti Elettronica Installs Cemco’s Digital Drive + Quicksilver Hot Air Leveler


Reading time ( words)

Cemco, through its Italian distributor Cipel Italia, has sold its latest Digital Drive + Quicksilver Hot Air Leveler to Esse Ti Elettronica in Vicenza, Italy.

“The evolving PCB market is placing an increasing demand on the need for higher quality surface finishes, while the requirement for larger panel sizes continues to grow,” says Silvio Fabrello, Esse Ti owner. “The new 30” Digital Drive + System incorporates innovations and features for the HAL process, enabling us to provide the highest levels of quality to our customers. We have been using a Quicksilver for more than 10 years; Quicksilver’s reliability and Cemco’s competent and punctual service has made our decision to purchase another an easy one.”

The Digital Drive + Quicksilver incorporates a higher level of control, making setting more precise; and recording and reporting, faster and easier.

For more information contact info@cemco.com.

Share

Print


Suggested Items

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

Reliability... It All Comes Down to the Landing

07/17/2019 | Nolan Johnson, I-Connect007
Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Whether in medical devices, autonomous vehicles, or in IoT, reliability will be crucial to both our success and safety.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.



Copyright © 2019 I-Connect007. All rights reserved.