Koh Young and ASM Assembly Systems Working with KSMART Partners Toward Zero-Defect Line


Reading time ( words)

Koh Young Technology is collaborating with its KSMART partners like ASM Assembly Systems to realize machine connectivity and create a zero-defect production line. Koh Young will demonstrate the latest connectivity solutions for optimizing printers at productronica in Munich, Germany during November 14-17.

Automated Printer Optimization

Rising demand for smaller, lighter, and smarter electronic devices has led to an increasing use of ultra-fine pitch packages, such as flip chips and chip scale packages in printed circuit board assembly (PCBA). These shrinking packages force smaller aperture designs and finer solder paste, which have made stencil printing a highly-sophisticated process with a tremendous impact on production yields. In fact, 70 percent of all PCB assembly defects are primarily due to problems directly associated with the solder printing process. Therefore, manufacturers must ensure the optimal printing paraments are consistently applied during production.

Growth Trajectory towards a True Connectivity

Defining the correct process parameters often requires a high degree of expertise, because of the various environmental considerations affecting the process. Using Machine-to-Machine (M2M) connectivity, Koh Young Technology and its KSMART printer and mounter partners can overcome the challenges.

KSMART Process Optimizer

The KSMART Process Optimizer (KPO) is a key deliverable from the collaborative projects with partner companies like ASM Assembly Systems, ASYS Systems, Speedline, Panasonic Factory Solutions, and others. Powered by its Intelligent Platform (IP) for adaptive learning, KPO has evolved far beyond its roots as a simple closed-loop option that continuously monitors and adjusts processes to maintain a target value.

The enhanced KPO solution, comprised of three interlinking software modules, actively optimizes the printing process by combining real-time printing information with SPI measurement data. Print Advisor Module (PAM) automatically performs DOEs designed to perform a detailed SPI result analysis using advanced diagnostic algorithms and noise filtering models, and then recommends the ideal print parameters. Printer Diagnostic Module (PDM), the second module, uses multiple anomaly-detection algorithms to actively optimize the print process and further reduce false calls. The final module, called POM (Printer Optimizer Module), uses the Koh Young adaptive learning engine to generate models and fine-tune process parameters. While each module provides inherent standalone process benefits, the combined power of KPO and the three modules ensures the highest process reliability and production flexibility without dedicated resources and expertise.

M2M Connectivity

Koh Young is also working with mounter partners to achieve complete line communication and further enhance the value of its true 3D inspection solutions. With the help from its KSMART partners, Koh Young has leveraged the power of true machine connectivity. Its M2M Connectivity solution optimizes the process by exchanging real-time measurement data between SPI and AOI systems, as well as printers and mounters. Koh Young systems feed offset and warning data to other systems, while analyzing trends for process optimization and traceability. Combining the new modules provides unsurpassed performance power. For example, Link@KSMART, which connects all the inspection systems within a line gains further benefits when combined with M2M@KSMART. Together with our partners, we are working to optimize the SMT line and achieve a zero-defect future.

“Networked intelligent systems that allow real-time results to be correlated, calculated, and visualized will become even more essential in the Smart Factory,” said Eric Jeon, Director of R&D at Koh Young Technology. “By working with our KSMART partners, we can add value to our SPI and AOI users. As part of this partnership, we look forward to continuously pushing the boundaries of the technology,” concluded Mr. Jeon.

As the absolute leader in the SPI and AOI markets, Koh Young will display a broad sampling of its latest developments, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2.

About Koh Young Technology Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers. For more information, click here.

Share


Suggested Items

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

12/28/2017 | Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.



Copyright © 2018 I-Connect007. All rights reserved.