Koh Young Expands AOI Capabilities to Backend Process


Reading time ( words)

Koh Young Technology will demonstrate new backend process AOI capabilities with the KY-P3 3D pin inspection solution at productronica 2017, which will be held on November 14-17 in Munich, Germany. Koh Young will be in Hall A2 Booth 377.

Using its world-class 3D AOI technology as the foundation for development, Koh Young designed the KY-P3 to overcome longstanding industry challenges like lengthy programming time and high false call rates. Following its guidance, the new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit and more pin configurations as well as applications like Final Optical Inspection (FOI) for engine control units. The system also measures pin height, solder height and pin tip separation with accuracy and repeatability.

Beyond pin measurement and inspection capabilities, the new KY-P3 incorporates the latest technologies to make programming faster and easier. The Koh Young Artificial Intelligence-driven Auto Programming software allows users to quickly generate inspection condition setting using our leading-edge Artificial Intelligence engine and optimized graphical user interface.

The known leader in electronics measurement and inspection, Koh Young is expanding its technology beyond the PCB industry. For example, the new MOI (Machining Optical Inspection) system is quickly being adopted by some of the industry’s largest smartphone makers. Koh Young is achieving its guiding vision “Measure Everything, Everywhere.”

As the absolute leader in the SPI and AOI market, Koh Young will display a broad display innovations, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2, you can learn more about Koh Young Technology and its best-in-class inspection solutions here

About Koh Young Technology Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.