CyberOptics Integrates Advanced MRS Tech into 3D SPI System


Reading time ( words)

CyberOptics Corporation will demonstrate the new SE3000 3D SPI system with a proprietary Multiple-Reflection Suppression (MRS) sensor in Hall A2 Stand 439 at productronica 2017, scheduled to take place November 14–17, 2017 at the Messe München in Germany.

The SE3000 3D SPI system is the very first SPI system to incorporate the industry-leading MRS sensor technology, with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. The unique sensor architecture simultaneously captures and transmits multiple images in parallel, while highly sophisticated 3D fusing algorithms merge the images together, delivering microscopic image quality at production speed. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.

"Smaller and mobile is a key trend driving the demand for an even higher level of accuracy and resolution," said Dr. Subodh Kulkarni, President and CEO, CyberOptics, "We've optimized our proprietary MRS sensor technology that is widely used for Automated Optical Inspection applications world-wide, and integrated it into our new SE3000 SPI system to address these critical customer requirements better than any alternate solution."

For maximum flexibility, the new SE3000-DD 3D AOI dual lane, dual sensor system caters to varying widths. This unique design provides the ability to inspect high volumes, the convenience of inspecting different board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.

At productronica Germany, CyberOptics will also unveil the new SQ3000 3D CMM system and the new SQ3000-DD 3D AOI system, both powered by MRS technology.

About CyberOptics

CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

For more information, click here.

Share


Suggested Items

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.



Copyright © 2018 I-Connect007. All rights reserved.