Easier Way to Produce High Performing, Flexible Micro-Supercapacitor
January 18, 2018 | KAISTEstimated reading time: 1 minute
Professor Minyang Yang from the Department of Mechanical Engineering and his team developed a high-energy, flexible micro-supercapacitor in a simple and cost-effective way.
Compared to conventional micro-batteries, such as lithium-ion batteries, these new batteries, also called supercapacitors, are significantly faster to charge and semi-permanent.
Thin, flexible micro-supercapacitors can be a power source directly attached to wearable and flexible electronics.
However, fabrication of these micro-supercapacitors requires a complex patterning process, such as lithography techniques and vacuum evaporation. Hence, the process requires expensive instruments and toxic chemicals.
To simplify the fabrication of micro-supercapacitors in an eco-friendly manner, the team developed laser growth sintering technology. This technology manufactures superporous silver electrodes and applies them to the supercapacitors’ electrodes.
The team used a laser to form micro-patterns and generated nanoporous structures inside. This laser-induced growth sintering contributed to shortening the manufacturing process from ten steps to one.
Moreover, the team explored this unique laser growth sintering process –nucleation, growth, and sintering –by employing a particle-free, organometallic solution, which is not costly compared to typical laser-sintering methods for metallic nanoparticle solutions used in the printing of micro-electrodes.
Finally, unlike the typical supercapacitors comprised of a single substance, the team applied an asymmetric electrode configuration of nanoporous gold and manganese dioxide, which exhibits a highly-specific capacitance, to operate at a high voltage.
This method allows the team to develop energy storage with a high capacity. This developed micro-supercapacitor only requires four seconds to be charged and passed more than 5,000 durability tests.
Professor Yang said, “This research outcome can be used as energy storage installed in wearable and flexible electronic devices. Through this research, we are one step closer to realizing a complete version of flexible electronic devices by incorporating a power supply.”
This research, led by PhD candidate Jae Hak Lee, was selected as the cover of Journal of Materials Chemistry A on December 21, 2017.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: