Rogers Corporation Introduces RO4460G2 Bondply


Reading time ( words)

Rogers Corporation is pleased to introduce RO4460G2, a low loss bondply with a 6.15 dielectric constant (Dk). RO4000 thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the already released RO4360G2 low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates.

RO4460G2 bondply exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400 bondplies are capable of withstanding multiple lamination cycles. Each of the RO4400 bondplies have the UL V-0 flame retardant rating, and are compatible with lead-free processes.

About Rogers Corporation

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.

Share


Suggested Items

Calumet Electronics on IMPACT 2018

08/14/2018 | Patty Goldman, I-Connect007
This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.

Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme

08/10/2018 | Jin Erbing, Joint Stars Technology Co., Ltd
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.

Advanced Copper Plating Process for Any Layer Via Fill Applications with Thin Surface Copper

08/07/2018 | Saminda Dharmarathna, Christian Rietmann, et al.
Copper-filled microvias are a key technology in HDI designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard PTHs, copper-filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost.



Copyright © 2018 I-Connect007. All rights reserved.