Alpha to Highlight High-Rel Products for EVs at PCIM Exhibition


Reading time ( words)

Alpha Assembly Solutions will highlight its range of advanced solutions for Electric and Hybrid Electric Drivetrains at the PCIM Exhibition in Nuremberg, Germany from June 5-7.

As the demand for electric and hybrid electric vehicles increases in response to new government and environmental policies to tackle CO₂ emissions, the need for automotive electronics to be robust and highly reliable has never been greater. Alpha, a Macdermid Performance Solutions Business, has developed a range of highly reliable die attach solutions to ensure optimum performance and lower warranty costs for automotive manufacturers.

“Alpha’s range of die attach solutions for electric vehicle drivetrains provide high thermal and electrical conductivity and high reliability” comments Julien Joguet Global Business Market Manager, Die Attach at Alpha Assembly Solutions. “ALPHAArgomax products provide a dramatic reduction in thermal resistance and inductance and 15x higher reliability than traditional solder methods.”

As well as its products for electric vehicle drivetrains, Alpha will present its products for ADAS (Advanced Driver Assistance Systems) and 5G Integration, including ALPHA Atrox Conductive Adhesive and ALPHAMaxrelSolder Alloy. “ALPHAAtroxprovides high thermal conductivity for high frequency ADAS and 5G computing, as well as enabling high reliability sensor integration”, explains Gyan Dutt, Global Portfolio Manager Die Attach Assembly Solutions at Alpha. “As well as this, the ALPHA® Maxrel Solder Alloy provides industry leading creep and vibration resistance which is crucial in areas such as the vehicle Engine Control Unit which is often exposed to extreme environmental conditions.”

For more information on Alpha’s die attach solutions for automotive applications please visit Alpha at PCIM Hall 7 Booth #518.

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges.  Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services.  For more information, click here

 

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.