-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Global Flexible Substrates Market to Witness Stellar CAGR During 2015-2021
October 15, 2019 | PMREstimated reading time: 2 minutes
Crystalline solar cells are made up of silicon wafers. Cell processing is initially independent of the substrate material, which is usually made up of glass and solar cells and modules are separated from the start on a suitable substrate. A substrate is a glass pane which is several millimeters wide. On the front side of a solar module in particular, the glass offers the important advantage that it is insensitive to environmental influences and that it provides excellent mechanical stability which can resist extreme conditions such as heavy snow loads and even hail .
Flexible substrate materials are used for exploration of photovoltaics. In addition, the deposition on flexible substrates offer the potential for significant cost reduction due to the large decrease in energy levels required for heating the film prior to coating .
Flexible substrates are also defined as ultra-thin and ultra-light base components, upon which electronic devices are deposited at the time of accumulation of electronic circuits, in order to fabricate extremely lightweight and rollable flexible electronics. Some of the most-commonly used materials in flexible substrates are glass, plastic, and stainless steel.
In terms of geography, North America dominates the global flexible substrates market due to improved electronics technologies in this region. The U.S. represents the largest market for flexible substrates, followed by Canada in North America. In Europe, Germany, the U.K., Spain, Italy, and France hold major share of the flexible substrates market. Asia is expected to witness high growth rates in the next five years in the flexible substrates market, as many companies are constructing manufacturing facilities in this region. Less stringent wagesand availability of skilled labor attracts manufacturing companies to invest in Asia. In addition, improving electronics technologies is also boostinggrowth of the flexible substrates market in this region. Japan, China, and India are expected to be the fastest-growing flexible substrates markets in Asia .
Emerging field of printed electronics technologies is the key driver of growth of the global flexible substrates market. Printed electronics technologies are used to create electrical devices on various substrates. In addition, increasing demand for organic light emitting diodes (OLED) is also boosting growth of the global flexible substrates market. OLEDs are light-emitting panels made from carbon-based organic materials that emit light when electricity is applied. OLEDs are used to make beautiful and efficient displays, and to create white light panels for lighting.
Moreover, development of flexible medical devices and increasing adoption of organic electronics-based IC designing methods for non-invasive monitoring devices indicatepotential for growthofthe global flexible substrates market.
However, stringent regulations restrain growth of the global flexible substrates market. Rising product launches and increasing number of mergers and acquisitions among drug manufacturing companies are some of the latest trends in the global flexible substrates market.
Some of the major companies operating in the global flexible substrates market are E.I. DuPont de Nemours and Company, Heraeus Materials Technology GmbH & Co. KG, SCHOTT North America, Inc., Heraeus Packaging Technology, American Semiconductor, Inc., 3M Company, Arlon Graphics LLC, BenQ Materials Corporation, Griff Paper and Film, AzCoat, Inc., Corning, Inc., Rogers Corporation, Porex Corporation, Polyonics, Inc., and Griff Paper and Film.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).