Bosch Sends Sensor System to ISS
November 4, 2019 | BoschEstimated reading time: 2 minutes
Is the International Space Station intact? This question could soon be answered by Bosch’s SoundSee technology. The highlight of troubleshooting in space is that it works by analyzing sounds and using artificial intelligence.
Bosch in North America and Astrobotic Technology Inc. have announced a research partnership to send experimental sensor technology to the International Space Station (ISS) in November 2019. Bosch’s SoundSee technology is a deep audio analytics capability that uses a custom array of microphones and machine learning to analyze information contained in emitted noises. SoundSee’s analytics will investigate whether audio data from equipment could be learned and understood using advanced software, such that it could be used to improve the operations of the ISS.
“Machines, such as motors and pumps, emit noise signatures while they operate,” said Dr. Samarjit Das, principal researcher and SoundSee project lead at Bosch Research and Technology Center in Pittsburgh. “Our SoundSee AI (artificial intelligence) algorithm uses machine learning to analyze these subtle acoustic clues and determine whether a machine, or even a single component of a machine, needs to be repaired or replaced.” The SoundSee payload will ride on NASA’s Astrobee Robot, an autonomous free-flying vehicle capable of navigating throughout the ISS.
On the ISS, researchers will collect data and send it to Earth for Bosch to study. As research progresses, the team expects to update the software or adjust operational routines to improve data-collection results. Jon Macoskey, research engineer intern at Bosch, said, “Our long-term goal is to show that we can detect anomalies in the operation of the station and return that intelligence to crew members or ground control.”
“Bosch has long been interested in using audio analytics to monitor critical machines and equipment, such as car engines or HVAC systems,” said Dr. Joseph Szurley, a Bosch research scientist. “The ISS will allow us to study how these techniques can extend to even more challenging and unique environments.” Astrobotic’s Future Missions and Technology team, a space robotics research group, is developing the flight version of the sensor, known as the SoundSee payload.
The team will also lead ground testing and preparation for flight. “Conducting research in space, even when you have an asset like the ISS, is significantly more challenging than testing on the ground,” said Dr. Andrew Horchler, Astrobotic research scientist and director of Future Missions and Technology. “As a space robotics company, we are able to help Bosch prepare for operating in this highly controlled space environment.”
The SoundSee project has been in development since the Center for the Advancement of Science in Space (CASIS) approved funding for launch costs and astronaut time aboard the space station earlier this year. CASIS is the organization tasked by NASA with managing the ISS U.S. National Laboratory. Recently, Bosch and Astrobotic researchers began testing engineering units of the SoundSee payload and added former ISS Commander Dr. Colin Foale to the team. “Since meeting the team at Astrobotic in Pittsburgh for the SoundSee preliminary design review, I am convinced that this novel, cutting-edge approach to using machine learning in space will not only have great benefits for troubleshooting ISS problems, but especially throughout industry on Earth,” Foale said.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).