Ventec Launches High-Speed Material Option Cladded with Thin-Film Resistor Foil

Reading time ( words)

For enhanced high-speed signal-handling performance required by the world's most demanding high-frequency Printed Circuit Board applications, Ventec International Group has launched a laminate option to its tec-speed 20.0 glass-reinforced hydrocarbon and ceramic laminate cladded with thin-film resistor material from Ticer.

Ventec's tec-speed 20.0 material, which combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.0027-0.0037), superior loss characteristics and highest reliability, is now available cladded with Ticer TCR© NiCr thin-film resistor foil as a service option. Essentially being inductor-free, the addition of the resistive material technology offers an enhanced material solution for some of today’s high-speed, low-loss, high-frequency applications where absolute performance and reliability are essential. These include aerospace & defense, radar, control circuits, sensor technologies, wireless communications, MEMS microphones/sensors/motors and medical diagnostic type applications.
Driven by the demand for reduction of dimensions and manufacturing costs of these types of devices, multi-layer technologies are one of the solutions that offer an increase in component packaging density. By adding the resistive foil layer in between the substrate and the copper layer, resistors can be embedded inside of PCBs after the lamination process.

Consequently, additional efficiencies the shorter distance between the embedded passives and active components achieves additional efficiencies that result in better signal transmission, less cross talk and improved electrical signal performance at high frequencies through lower loss and noise. In addition, material cost reduction, yield improvement, defect reduction and ultimately an optimized production cycle time and time to market can be achieved.

The embedded resistor foil layer material option named tec-speed 20.0 VT-870 H348 TCR is available in Hoz and 1oz thick foil with resistivity values of 25, 50 and 100 Ω/sq.

“The high-speed signal-handling performance of our latest VT-870 H348 TCR material cladded with Ticers’ unique technology provides additional efficiencies for Ventec’s tec-speed 20.0 material,” noted Mark Goodwin, COO Europe & America. “It allows us to offer our customers an even greater choice of the best in high-quality, high-performance and reliable base material technology – all of course supported by our fast and efficient global delivery promise through our fully controlled global supply chain and dependable technical support.”

About Ventec International Group

Ventec International Group Co., Ltd. (6672 TT) is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.

03/29/2023 | Andy Shaughnessy, Design007 Magazine

Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.

03/16/2023 | Pete Starkey, I-Connect007

Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

02/28/2023 | Pete Starkey, I-Connect007

Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.