Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For

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I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2.

This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

Written by Ventec International Group’s Didier Mauve, Head of Global OEM and Technology, and Robert Art, Global Account Manager IMS/TIM, this book also addresses the key challenge of how to improve reliability of components as they become increasingly smaller and more efficient.

Peer reviewer Jan Pedersen, Director of Technology at NCAB Group, says, “IMS materials have been in the marketplace for decades now without a standard for the user's reference. This textbook is an important contribution to the understanding of IMS materials and, specifically, the focus on total thermal resistance and the new IPC Test Method TM-650 2.3.54.”

Readers will learn the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material; the effects of measurement errors and tolerance in dielectric thickness can also vary.

Download your free copy today at I-007eBooks.com. You can also view our full library at I-007eBooks.com.

Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available. 

Look for other exciting titles in this series, like:

• Stackups: The Design within the Design
• High Performance Materials
• System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
• …and more coming this summer

We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2.

For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)

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At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.

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02/28/2023 | Pete Starkey, I-Connect007

Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.