-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Majority Sale of Schweizer China Confirmed by WUS Shareholders
April 18, 2023 | Schweizer Electronic AGEstimated reading time: 2 minutes
The shareholders' meeting of WUS Printed Circuits (Kunshan) Co, Ltd (WUS) approved the acquisition of a majority stake in Schweizer Electronic (Jiangsu) Co, Ltd (SEC). As a result, WUS's shareholding in SEC will increase from the current level of approximately 13% to 70%. The transfer of the shares and payment of the purchase price is expected to take place before end of April 2023.
Parallelly, WUS will carry out a capital increase of around EUR 29 million at the joint venture in China, in which Schweizer Electronic AG will not participate. Finally, SCHWEIZER will thus hold around 20% of the joint venture in China. This capital increase is also expected to take place in April.
The conclusion of this transaction for the joint venture in China is also the starting signal for further intensification of the long and successful cooperation with WUS. Already now, SCHWEIZER generates almost 30% of its consolidated sales through cooperation in the field of high-frequency PCBs.
Both companies have agreed to significantly expand this cooperation model. SCHWEIZER will thus significantly widen its range of competitive and high-technology PCBs globally. The core of the strategy remains the plant in Schramberg, Germany, with a central role not only by its technological excellence but also by improving supply chain resilience for European and American customers, as well as the joint venture in China, with focus on ensuring high production volumes of chip embedding technology. The joint venture will continue to operate under the name Schweizer Electronic, to represent European technology competence - produced in China. Under the new majority structure Schweizer Electronic AG will still retain a seat on the Board of Directors of SEC and will thus be able to actively influence the business processes in the joint venture.
In addition to the plant in Germany and the joint venture in China, SCHWEIZER will also have full access to the technologies of the other WUS plants. SCHWEIZER is thus expanding its offer based on a unique network in Germany, Taiwan, China and, in future, also Thailand.
This enables SCHWEIZER to address additional product and market segments and increases the opportunity for additional growth without the need for own high investments in production capacities. SCHWEIZER will develop from a manufacturer of highly specialised PCB technologies for niche segments to a system provider of a broad technology portfolio from Germany, China and Southeast Asia, and offer customers increasingly important additional services such as supply chain resilience, local value creation, global sales organisation, protection of sensitive intellectual property and the technological consulting expertise of a PCB manufacturer, which has convinced its customers over decades with competence and reliability.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).