IPC APEX EXPO 2013 Courses Go Beyond Theory


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Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.

Covering issues in design, lead-free technology, materials, process improvement, solder joint reliability, and more, the courses will go beyond theory to provide practical solutions to industry issues and challenges. Each course is led by a subject-matter expert, runs for three hours and will include an instruction handbook.

Industry experts such as Mike Carano of OMG, Happy Holden of Gentex, Cheryl Tulkoff of DfR, Bob Wetterman of BEST, and Phil Zarrow of ITM will offer one or more courses. Course highlights include:

  • Design for Manufacturing (DFM): Best Practices (PD08);
  • Extreme HDI: Designing for Maximum Density (PD10);
  • Best Practices in Electronics Assembly Processes (PD13 and  17);
  • Tin Whiskers: Failure Risk and Mitigation Strategies (PD21);
  • Ball Grid Array: Principle and Practice (PD30); and
  • Package on Package: Design, Assembly, Rework and Inspection (PD44).

“The courses at IPC APEX EXPO will enable engineering and management staff to work smarter in an era of increasing product sophistication,” says Susan Filz, IPC director of industry programs. “Attendees will bring home new insights and solutions to boost their productivity.”

Engineers like Rigo Garcia, Sr. Quality Assurance Engineer, NASA Goddard Space Flight Center agree, “The conference and courses offer a great opportunity to increase my value as a professional…and having the chance to talk to the technical experts and see equipment being used today is incredibly valuable.”

The complete list of professional development courses along with full descriptions and instructor biographies is available here.    

Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 will save 20% on registration fees. A new registration option for 2013, the Maximum Value Package (MVP) includes a choice of up to six half-days of professional development, all technical conference sessions, standards development meetings, luncheons, and more--all with a savings of more than 75% over individual item prices. For more information or to register for IPC APEX EXPO, click here.

About IPC

IPC is a global industry association based in Bannockburn, Illinois, dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, New Mexico; Arlington, Virginia; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China. For more information, visit www.ipc.org.

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