Papers Sought for IPC APEX EXPO 2016


Reading time ( words)

IPC is inviting all industry professionals to submit an abstract for one of the industry's premier technical conferences, or provide a course proposal for one of its largest educational events.

Presenting at IPC APEX EXPO 2016 in Las Vegas will provide significant visibility for you and your organization. Thousands of individuals will receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers and prospects.

Submissions are being sought on design, materials, assembly, processes and equipment in areas such as adhesives, advanced technology, assembly and rework processes, automation in electronics manufacturing, packaging, business and supply chain issues, cleaning, conformal coatings,counterfeit electronics, electronics manufacturing services, flexible circuitry, HDI technologies, PCB fabrication, photovoltaics, PoP (Package-on-Package), printed electronics, reshoring, RFID circuitry, robotics, soldering, surface finishes, test, inspection and AOI, and tin whiskers, among others.

To submit the abstracts, visit www.IPCAPEXEXPO.org/CFPapers. For more information, contact Jasbir Bath at JasbirBath@ipc.org, or Toya Richardson at ToyaRichardson@ipc.org.

Abstracts are due August 14; and acceptance by September 4. Papers are due November 13, while presentations due December 11.

Share


Suggested Items

HDI: Born in the USA and Making a Comeback

11/22/2017 | Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

3D Printed Electronics for Printed Circuit Structures

10/04/2017 | Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.

The State-of-the-Art in PCB Pre-production Engineering

09/21/2017 | Pete Starkey, I-Connect007
If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.



Copyright © 2017 I-Connect007. All rights reserved.