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It's less than two weeks away before the European Institute of Printed Circuits (EIPC) Summer Conference. To be held in Berlin from June 18 to 19, this year's event will include a guided tour of the Fraunhofer Institute.
The conference will have an iconic selection of speakers, including Alun Morgan, EIPC Chairman, who will present a market outlook on behalf of Walt Custer who is unable to join this year, as well as luminaries as Dr. Ivan Ndip, Lars Böttcher and Dr. Olaf Wittler, all from Fraunhofer IZM. Walter Huck of IEC and Martyn Gaudion of Polar Instruments will also be present, so as speakers from AT&S, Thales, Cimulec, Atotech, Taiyo, Camtek, First EIE, Du Pont and Cambridge Nanotherm, to name a few.
Download the conference registration form by clicking here.
For the detailed conference programme, click here.
Chris Mitchell, IPC Vice President of Global Government Relations
The recent surge in COVID cases provoked more than a few questions about what to expect at this year’s IPC APEX EXPO. But as I traversed the San Diego Convention Center last week, the top answer was clear: a lot of smiles! Sure, they were hidden behind masks, but they were evident in the eyes of everyone I met. Attendees were thrilled to be back together in person, sharing ideas as freely as elbow bumps. IPC is a community, and APEX EXPO is the place where we build it.
Nolan Johnson, I-Connect007
I-Connect007 is here in San Diego, setting up our booth on the show floor for the exhibition portion of IPC APEX EXPO. Technical conferences and programs start today, and the show floor has filled with all the biggest names in our industry. Registration has been smooth and everyone seems to be wearing masks.
Tara Dunn, Averatek
Looking back to my notes from IPC APEX 2020, I noticed one of my comments: There were so many interesting sessions that I often found myself in the position of choosing between several that I wanted to attend in the same timeslot. This year was not any different in that regard. I am purposely glossing over the fact that I, like many of my friends, missed the camaraderie and opportunity to catch up in person while attending these technical sessions, and I look forward to being able to do that next year.