Novel High-Performance Substrate for Stretchable Electronics


Reading time ( words)

Stretchable circuits are an evolving branch of electronics interconnection technology and the subject of growing interest to product developers seeking to provide novel wearable electronic solutions for consumer and medical markets. Such circuits are designed and manufactured using resilient materials which allow them to expand and contract with the movements of the user or to conform to nonplanar surfaces making possible a wide range of innovative and fanciful electronic interconnection devices. Obviously, the material used is a key element in making a stretchable circuit.

There are a range of different types of thermoplastic polymers available in film form that can be effectively stretched; however, once stretched beyond their elastic limit the material deforms to a new length greater than that which was designed.

There are as well elastomeric materials, such as urethanes, which have seen use in the manufacture of circuits which can be stretched and return to their original length. These materials tend to be opaque, which limits the scope of possibility for their use. A new transparent, high-performance thermal setting stretchable material could open doors to a range of new and innovative products.

New stretchable material characteristics

The new material is capable of stretching to 150% of the original length without hysteresis. (Figure 1 provides a comparison of stress-strain plots of the new material compared with thermoplastic PEN.)

stretchable_fig1.jpg

Another key attribute of the material is its ability to reliably return to the original length even when stretched numerous times, as will likely be required in numerous future applications. The new material excels in this regard.

The mechanical and thermal properties of the new material are superior in many important areas including total elongation and adhesion both to copper foil and FR-4 laminate. It is also unique in that is has no melt point making it amenable to soldering with higher temperature lead free solders.

Read The Full Article Here

Editor's Note: This article originally appeared in the June 2015 issue of The PCBMagazine.

Share

Print


Suggested Items

Solder Mask Tack Dry

11/08/2019 | Nikolaus Schubkegel
As a general rule, the tack-dry temperature should be as low as possible; in other words, it should only be as high as necessary. If the temperature is too low, the evaporation rate for the solvent will be to slow, and the solder mask will not dry in a reasonable amount of time. If the temperature is too high, however, the dry time certainly will be excellent, but it could create a solder mask lock-in with repercussions by the developing time.

Meet George Milad, I-Connect007 Columnist

10/31/2019 | I-Connect007 Editorial Team
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.

New High-speed 3D Surface Imaging Technology in Electronics Manufacturing Applications

10/09/2019 | Juha Saily, Focalspec Inc.
Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.



Copyright © 2019 I-Connect007. All rights reserved.