Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Insulectro Expands Sales Leadership to Meet Demands of Changing Marketplace
June 16, 2015 | InsulectroEstimated reading time: 3 minutes
Insulectro, a leading distributor of materials for use in the PCB and printed electronics industries, has announced promotions to the leadership of its sales division.
“2015 has been a strong year for us in both the PCB side of our business as well as our new printed electronics initiatives,” Insulectro Vice President of Sales Ken Parent commented. “It’s time to increase our focus on sales and service with two well deserved promotions.”
Effectively immediately, longtime Insulectro veterans Trey Adams and Sean Redfern become Regional Vice Presidents for the Eastern US and Western US respectively. Both Adams and Redfern will continue to report to Parent.
“Insulectro has long had a national footprint with its 10 stocking locations domestically. We learned years ago we want to be where our customers are. It makes sense that we also specialize our sales management regionally to align with our operations,” Parent continued.
Under the new plan, Trey Adams will assume responsibility for sales in Londonderry, NH; Bloomingdale, IL; Dallas, TX; and Eden Prairie, MN (Insulectro’s new location in the Twin Cities area); and Canada. Adams will also oversee sales efforts, as well, in the Pacific Northwest, an area he formerly served.
Redfern will lead the sales in Southern California, Silicon Valley, Tempe, AZ, and Aurora, CO,
Adams has been a key player in Insulectro’s growth and success in the Midwest PCB market for over 11 years. His intimate knowledge of PCB and PE products and has great rapport with customers making him invaluable to Insulectro’s OEM strategy by successfully embracing the company’s highly-touted ACT! Initiative (a synergistic program that advancing the needs of all members of the supply chain – OEM, designer, fabricator, distributor, and supplier).
Sean Redfern has been involved in leadership roles across most of the Redfern Companies during his 14 years, including Tri-Star Laminates (LCOA), relocating to Shanghai, China for nearly 2 years and establishing a presence in China with Tri-Star International Group (TIG), spearheading our sales and marketing efforts for Integral Technologies. For the past 1½ years Redfern has fulfilled a Regional Sales Management role for Insulectro in Southern California. His experience will be invaluable to Insulectro’s strategic growth initiatives along with his proven track record of building strong alliances with customers and suppliers.
“I’m pleased we have two remarkably talented sales leaders in these new, important roles. As a distributor of best-in-class materials from such PCB suppliers as Isola, DuPont, LCOA, CAC, Pacothane, Ormet Circuits, and Focus Tech Chemicals, along with DuPont, Kodak, Vistana, and Coveme, and others on the Printed Electronics side, we are in the middle of rapidly changing technologies and an amazing onslaught of new, high performance materials. I know Trey and Sean look forward to meeting Insulectro’s customers throughout their territories,” Parent stated.
“This is the first of several announcements we will make in the near future – all exciting and each providing new strategies for helping our customers strengthen their businesses,” Ken Parent concluded.
About Insulectro
Insulectro is the leading supplier of PCB materials used to manufacture circuit boards as well as materials for Printed Electronics. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Integral Technology, Pacothane, Vistana, and Focus Tech. These products are used by our customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.