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Each year, a new slew of terms and definitions become commonplace in the manufacturing process. To meet these needs, IPC – the Association Connecting Electronics Industries has released the report T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
T-50M delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
Revision M brings over 150 new terms, while eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. This revision includes terms often cited in other standards, such as conformal coating, statistical process control, and stencil design, to name a few.
For more information, click here.
I-Connect007 Research Team
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.
Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.