-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
Economic Headwinds
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Flexible and Stretchable Circuit Technologies for Space Applications
June 19, 2015 | M. Cauwe, F. Bossuyt, J. De Baets, and J. Vanfleteren, Laboratory for Advanced Research in Microelectronics (imec) Ghent UniversityEstimated reading time: 2 minutes
Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60μm thick chip package, including the embedding of a 20 μm thick chip, laser or protolithic via definition to the chip contacts and application of fan-out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material (e.g., polyimide). Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed.
The driving application for flexible and stretchable circuit technologies is consumer electronics, especially handheld and mobile devices, which benefit the most from the reduction in form factor, the increased functional density and enlarged user comfort that is made possible with these technologies. Reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability are benefits that are also appealing for space applications.
Traditionally, electronics and sensor circuits are fabricated on flat rigid substrates, like FR-4 PCBs. In this conventional technology, packaged integrated circuits (ICs) and passive components are assembled onto the rigid PCB by soldering. For many applications, especially for mobile, portable, wearable and implantable electronics, the circuit should preferably be seamlessly integrated into the object that is used for transportation, is carried along, or worn on or inside the body. The electronics should be comfortable and unnoticeable to the user. In general, standard circuits do not fulfil these requirements. The user comfort can be increased in two ways. Extreme miniaturisation of the circuit reduces the presence of the system. A second approach is to transform the flat rigid circuit into a three-dimensional, conformable variant, following the random shape of the object or body part onto which it is integrated.
In this contribution, two original technologies developed at imec-CMST are presented. The ultra-thin chip package (UTCP) technology embeds 20–30 μm thick chips in a stack of spin-on polyimide (PI) layers. Adding thinfilm, fan-out metallization results in an extremely miniaturized, lightweight and flexible chip package with a total thickness below 100μm. Next to flexible electronics, a number of technologies for dynamically or one-time deformable stretchable circuits are under development. The stretchable concept is based on the interconnection of individual components or component islands with meander shaped metal wirings and embedding in elastic polymers like silicone rubbers (PDMS), polyurethanes (PU) or other plastics.
Editor's Note: This article originally appeared in the June 2015 issue of The PCB Magazine.
Suggested Items
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Altium to Exhibit Latest Innovations at Embedded World 2024
03/15/2024 | AltiumAltium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.
Indium Corporation Celebrates 90 Years of Materials Science Innovation
03/13/2024 | Indium CorporationIndium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.