ZESTRON’s Ravi Parthasarathy to Present at IMAPS’s Advances in Semiconductor Packaging Exhibition

Reading time ( words)

ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.

Leadframe packages are widely used for semiconductor device fabrication.  Typically, the interconnections between an integrated circuit (IC) and the metal leads are made through the process of die attach and wire bonding. For die attach processes, the standard materials used are epoxy, adhesive or solder paste. Prior to wire bonding and molding processes, it is critical to remove post-solder flux residues in order to maximize overall yield. For companies that are manufacturing semiconductor devices, it is common to produce millions of units per day. As a result, incremental improvement in wire bond yield by a fraction of a percent can significantly impact production efficiency and the final product cost model.

This presentation reviews a design of experiment that was developed to improve a semicon manufacturer’s cleaning process and the resulting wire bond yield.

IMAPS’s Advances in Semiconductor Packaging will be held at SUNY Polytechnic Institute on Thursday, September 24th from 8:00 AM to 5:00 PM.  For more information on ZESTRON’s product lines, services, and learning opportunities, please visit our booth.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.


Suggested Items

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/01/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

Time to Get Serious About CMMC Readiness

07/13/2022 | I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”

Copyright © 2022 I-Connect007. All rights reserved.