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2015's Most Read PCB Interviews
December 30, 2015 | I-Connect007Estimated reading time: 2 minutes
Over the course of the year, we have talked to a lot of industry experts and engineers about the latest technology developments and business opportunities and challenges in the PCB fabrication industry. For 2015, here are the top 10 most-read interviews.
Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market
Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, Iconnect007 technical editor Pete Starkey caught up with eIpc’s Michael Weinhold and alun Morgan, who were happy to discuss both recent and ongoing focuses for eIpc, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
A Conversation (and Day) with Joe Fjelstad
I-Connect007 publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying their conversation that ebbed and flowed between a wide variety of topics including the “war against failure.”
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: Everyone Has Their Eye on India
09/03/2025 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.