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The best technical conference paper of IPC APEX EXPO 2016 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, March 15.
Taking top honors, the winning paper is “Round Robin of High Frequency Test Methods by IPC-D24C Task Group,” by Glenn Oliver, DuPont Electronics & Communications. His co-authors were John Andresakis, Park Electrochemical; Chudy Nwachukwu, Isola; John Coonrod, Rogers Corporation; David L. Wynants, Sr., Taconic Advanced Dielectric Division; and Don DeGroot, Connected Community Networks, Inc. The paper will be presented during Technical Conference Session 10 on Wednesday, March 16.
An honorable mention went to “Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads,” by Simon Wolfangel, Robert Bosch GmbH. His co-authors included: Udo Welzel, Stefan Scheller, Marc Nikolussi and Dietmar Schlenker, all of Robert Bosch GmbH. This paper will be presented during Technical Conference Session 1 on Tuesday, March 15.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
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IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.