Fore! Sign up for the SMTA International Golf Tournament

Reading time ( words)

The 9^th Annual SMTAI Golf Tournament takes place on Thursday, September 29, 2016, and the Maple Meadows Golf Club. This championship course features a modern combination of links and a prairie design. It’s conveniently located just 10 miles from the Convention Center. Wrap up the week with a day on the links.

COST:
$80 per player, $320 per foursome team
Price Includes:

• · Round of Golf (18 Holes)
• · Golf Cart per 2 Golfers
• · Drink Tickets
• · Hot Buffet Lunch
• · Chance to win performance prizes (i.e., longest drive, closest to pin, 1st-3rd place foursomes)

8:30 am Shotgun Start
50+ Players
Best Ball Scramble
Prizes for Performance
Hot Buffet Lunch
Networking!  

To register, click here.

06/12/2020 | Nolan Johnson, I-Connect007

On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA

Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

07/08/2019 | Tony Lentz, FCT Assembly

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.