Insulectro’s Technology Village to Feature 30 Powerchats at IPC APEX EXPO

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Insulectro, the largest distributor of materials used in the manufacture of printed circuit boards and printed electronics, has announced its schedule of the popular and successful 13.5 minute power chats during this year’s IPC APEX EXPO at the San Diego Convention Center, January 24-26, 2023.

This year, Insulectro is presenting a new concept for the tradeshow with the entire 1800 sqft megabooth being designed as a Technology Village complete with “storefronts” occupied by suppliers and a “Town Square,” home to PowerChats™.

The Insulectro PowerChats™, branded ipc@IPC and presented every 30-minutes, will provide details on many new products, processes and services offered by Insulectro and key suppliers DuPont, Isola, Celanese Micromax™, Denkai America, EMD Electronics, Pacothane Technologies, InduBond®, and Kyocera, plus special presentations by Altium, Polar, and PCBAA.

“We are pleased to continue our ipc@IPC - Insulectro Power Chats,” commented Ken Parent, Chief Operating Officer, “Our outstanding expert presenters have crafted short, info-packed learning sessions to be presented during IPC APEX EXPO. In 13.5 minutes per topic, attendees will learn the WHAT/WHY/HOW on critical topics.

“New products and technologies can change the way a board is designed and fabricated. In our field testing, we’re often hearing ‘We could have never made this board before’,” continued Parent. “We’re anxious to share emerging technologies in very concise power chats in our booth (Space 534).”

Insulectro Vice President of Technology Chris Hunrath (who also hosts the Chats along with well-known design expert Michael Creeden, Insulectro Technology Director) agrees, “Our IPC Power Chats have been enormously popular throughout the years. Often, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year is no exception. We have an incredible lineup of topics and presenters. You could spend the day with us every day of the show.” 

IPC@IPC Product Power Chats Schedule for Booth 534:

TUESDAY, JANUARY 24

10:30 am        Insulectro’s Technology Village
Michael Creeden, Technology Director, Insulectro

11:00 am        DuPont Automotive Solutions
Greg Roettger, Sr. Key Account Mgr, DuPont

11:30 am        Cutting Tools for Advanced Materials and HDI
Joe Negron, Sales Manager, Kyocera

12:00 pm        Making Intelligent Materials Selection
Michael Creeden, Technology Director, Insulectro

12:30 pm        Metallization & Imaging Processes for IC Substrates
Erik Reddington PhD, Commercial Leader, DuPont

1:00 pm          Pacothane Lamination Assist Product Overview
Lahcen Khiyaty, Product Dev & Technical Mgr, Pacothane

1:30 pm          Metallization & Plating of Stacked Vias in HDI
Carl Colangelo, Sr. Technical Advisor, DuPont

2:00 pm          SPECIAL PRESENTATION - What’s needed after the CHIPS Act?
Shane Whiteside, President & CEO, Summit Interconnect

2:30 pm          Optimize Collaboration with your PCB Manufacturer
Lawrence Romine, VP of Sales & Marketing, Altium 

3:00 pm          PE Trends Driving Innovation at Micromax™
Hee Hyun Lee, Micromax™ Lead Research Scientist

3:30 pm          Modeling Materials for Signal Integrity
Neil Chamberlain & Eric Bateham, Polar Instruments

4:00 pm          Lamination Basics
Chris Hunrath, VP of Technology, Insulectro 

4:30 pm          TerraGreen® 400G2, 400G, & 400GE
Michael McMaster, Director HSD Materials, Isola Group

5:00 pm          Introduction to PCB Copper Foil
Michael Coll, Chief Operating Officer, Denkai America

5:30 pm          Flex Materials in Outer Space: “Failure is not an option.”
Geoff Leeds, DuPont Flex Laminates Product Mgr, Insulectro 

WEDNESDAY, JANUARY 25

9:30 am          Insulectro’s Technology Village
Michael Creeden, Technology Director, Insulectro

10:00 am        Tool Selection for Flex/Rigid-Flex Drilling & Milling
Russell Reynoso, Design and Engineering Mgr, Kyocera 

10:30 am        New DuPont Resist for SAP/mSAP
Chris Cha, Technical Service Consultant, DuPont

11:00 am        Microvia Reliability
Geoff Leeds, DuPont Flex Laminates Product Mgr, Insulectro

11:30 am        Metallization & Imaging Processes for IC Substrates
Erik Reddington PhD, Commercial Leader, DuPont

12:00 pm        High-Speed Circuits with Advanced Micro Packaging
Michael Creeden, Technology Director, Insulectro

12:30 pm        PE Trends Driving Innovation at Micromax™
Hee Hyun Lee, Micromax™ Lead Research Scientist

1:00 pm          15 Emerging Predictions for Advanced Electronics
Michael Creeden, Technology Director, Insulectro

1:30 pm          Cutting Tools for Advanced Materials and HDI
Joe Negron, Sales Manager, Kyocera

2:00 pm          DuPont Automotive Solutions
Greg Roettger, Sr. Key Account Mgr, DuPont

2:30 pm          Optimize Collaboration with your PCB Manufacturer
Lawrence Romine, VP of Sales & Marketing, Altium®

3:00 pm          Introduction to PCB Copper Foil
Michael Coll, Chief Operating Officer, Denkai

3:30 pm          InduBond® - High Temperature Lamination and Fusion Bonding
Chris Hunrath, VP of Technology, Insulectro

4:00 pm          Ormet® Solving Design Challenges
Michael Creeden, Technology Director, Insulectro
Catherine Gallagher, Lead Paste Research & Development, EMD Electronics

4:30 pm          Tool Selection for Flex/Rigid-Flex Drilling & Milling
Russell Reynoso, Design and Engineering Manager, Kyocera

5:00 pm          TerraGreen® 400G2, 400G, & 400GE
Michael McMaster, Director HSD Materials, Isola Group

5:30 pm          Pacothane Lamination Assist Product Overview
Lahcen Khiyaty, Product Dev & Technical Mgr, Pacothane

THURSDAY, JANUARY 26

9:30 am          15 Emerging Predictions for Advanced Electronics
Michael Creeden, Technology Director, Insulectro

10:00 am        Metallization & Plating of Stacked Vias in HDI
Carl Colangelo, Sr. Technical Advisor, DuPont 

10:30 am        Data Collection: The 4.0 Way
Geoff Leeds, DuPont Flex Laminates Product 

11:00 am        High-Speed Circuits with Advanced Micro Packaging
Michael Creeden, Technology Director, Insulectro 

11:30 am        Paste with Ultra-Thin Foils for Build-Up HDI
Chris Hunrath, VP of Technology, Insulectro

All Power Chats are in Space 534 at IPC APEX EXPO. No sign-up required. For further information, visit our website – www.insulectro.com.

05/18/2023 | Mark Gallant, DownStream Technologies

Everyday rigid FR-4 PCBs have a well-known layer stackup recipe: dielectrics, PCB conductor layers, plane layers, mask, and silkscreen (nomenclature or legend). More advanced layer types may include embedded or screened components or cavities with bonded bare die. Flex and rigid-flex stackups include those similar to rigid PCBs, such as dielectrics, conductor, mask, and silkscreen layers, but that is where the similarity ends. There are many additional layer types present for this genre of PCB. They include types like coverlay, adhesive, conductive film, conductive foil, conductive adhesive, bondply, and stiffener.

04/17/2023 | Mark Gallant, DownStream Technologies

Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.

10/30/2022 | Andy Shaughnessy, Design007 Magazine

We recently conducted a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this third and final installment of the roundtable, these experts discuss some of the differences and similarities between PEC and traditional PCB processes, the future of printed electronic circuits, and why the best way to learn about this technology is through networking with veterans of this segment who are eager to share their expertise with the next generation.