Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

04/17/2024 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is delighted to announce Angela Marquez's appointment as the new Head of the Business Unit for Latin America.

NEOTech Promotes Emilio Ramirez to Chief Technology Officer

03/29/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the promotion of Emilio Ramirez to the position of Chief Technology Officer (CTO).

Foxconn Showcases AI Solutions for Servers, EV Driving at NVIDIA GTC

03/20/2024 | Foxconn
Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturing and service provider, announced its participation at NVIDIA GTC, showcasing the Group’s robust expertise in AI solutions that span exclusive, state-of-the-art server systems, advanced driver assistance systems for intelligent electric vehicles and groundbreaking deep learning research for autonomous driving called “QCNet.”

Scanfil Announces Updated Values, Strategy, Business Segments and Financial Targets

03/13/2024 | Scanfil
Scanfil plc announces its updated values, strategy, business segments and financial targets. “Geared for growth” describes Scanfil’s market position and opportunities.

Intraratio Names Ken Reilich as Senior Vice President of Worldwide Sales and Marketing

02/29/2024 | Intraratio
Intraratio is pleased to welcome Ken Reilich as its new Senior Vice President of Worldwide Sales and Marketing. In his new role, Ken will be instrumental in leading global sales and marketing initiatives driving Intraratio’s revenue growth and significantly enhancing Intraratio's market position.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in