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MEMS & Sensors Executive Congress 2023 to Spotlight Sensorization Driving Global Solutions

Industry visionaries and experts will gather November 6-8 at the MEMS & Sensors Executive Congress (MSEC 2023) at the WIGWAM Resort in Phoenix,...
Meta Materials, Panasonic Industry Collaborate on Next Generation Transparent Conductive Materials

This joint effort is expected to strengthen the supply of NANOWEB® films and accelerate the growth of the transparent conductive film industry,...
Altair Enhances Leadership in Optimization Technology by Acquiring OmniQuest

Altair, a global leader in computational science and artificial intelligence (AI), acquired OmniQuest, a Novi, Mich.-based optimization software...
RobotLAB Proudly Renews Longstanding NAO & Pepper Agreements With United Robotics Group

RobotLAB, the premier robotics integrator that has delivered impactful robotics business innovations and solutions for more than 15 years, has...
Sasken Technologies Collaborates with Qualcomm through IoT Accelerator Program

Sasken Technologies, a global leader in cutting-edge technology solutions, is excited to announce a collaboration with Qualcomm Technologies, Inc., a...
CML Announces Completion of Microwave Technology, Acquisition

CML, which develops mixed-signal, RF and microwave semiconductors for global communications markets, is pleased to announce that it has, completed...
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MEMS & Sensors Executive Congress 2023 to Spotlight Sensorization Driving Global Solutions
October 2, 2023 | SEMI
Meta Materials, Panasonic Industry Collaborate on Next Generation Transparent Conductive Materials
October 2, 2023 | ACN Newswire
Altair Enhances Leadership in Optimization Technology by Acquiring OmniQuest
October 2, 2023 | Altair
RobotLAB Proudly Renews Longstanding NAO & Pepper Agreements With United Robotics Group
October 2, 2023 | BUSINESS WIRE
Sasken Technologies Collaborates with Qualcomm through IoT Accelerator Program
October 2, 2023 | PRNewswire
CML Announces Completion of Microwave Technology, Acquisition
October 2, 2023 | CML
Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4 Technology
September 29, 2023 | Intel
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements
September 29, 2023 | Siemens
DuPont Leaders to Discuss Sustainability and Innovation in Semiconductor Materials at Strategic Materials Conference
September 29, 2023 | DuPont
Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
September 29, 2023 | Cadence Design Systems, Inc.
Test and Inspection Featuring:
- The Eyes Have It by Nolan Johnson
- ‘Testing’ a Strategy interview with Raj Vora and Darren Carlson
- Using Test Strategies Simulation in Test and Inspection Workflow by Will Webb
- Smarter Design Means Smarter Test and Results interview with Bert Horner
- Collaborating to Develop AI-powered Smart Assembly Processes by Brent Fischthal
Finding Ultra Featuring:
- Convergence by Nolan Johnson
- The Drive Toward UHDI and Substrates interview with Darren Hitchcock
- What is UHDI? by Happy Holden
- Cutting-edge Inspection Challenges by Brent Fischthal
- Pivoting on Substrates interview with Oved Shapira
- Building a Domestic ‘Silicon to Systems’ Ecosystem by Matt Kelly
Rigid-flex: Designing in 3D Featuring:
- An Overview of Rigid-flex Design, with Kris Moyer
- Rigid-flex Stackup: It’s a 3D World, by Bill Hargin
- Design for Manufacturing Principles for Flexible Circuits, by Vern Solberg
- Unlocking the Key to Rigid-flex Design Success, by Joe Fjelstad
- Rigid-flex Design Guidelines, by Cherie Litson
- Selecting a Rigid-flex Fabricator, by Mike Morando
- Human Ingenuity and the Rigid-flex PCB, by Tim Haag
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