-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ansys, NVIDIA Pioneer Next Era of Computer-Aided Engineering
March 29, 2024 | ANSYSEstimated reading time: 3 minutes
Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI. The expanded collaboration will fuse cutting-edge technologies to advance 6G technologies, supercharge Ansys solvers via NVIDIA GPUs, integrate NVIDIA AI into Ansys software offerings, develop physics-based digital twins, and customize large language models (LLMs) developed with NVIDIA AI foundry services.
Ansys recently joined the AOUSD to strengthen data interoperability and deliver enhanced graphics and visual rendering to its portfolio. Ansys has already connected Ansys AVxcelerate Autonomy™ to NVIDIA DRIVE Sim powered by the NVIDIA Omniverse platform, and plans to investigate additional integrations across the portfolio, including Ansys STK™, Ansys LS-DYNA™, Ansys Fluent™, and Ansys Perceive EM. This seamless interoperability will empower users to tackle a wide range of challenges, from factory-level to planetary-level simulations.
In addition to Omniverse integrations, the collaboration will prioritize advancements in four areas:
- Accelerated Computing: Ansys, working with NVIDIA, is enabling customers across industries to shorten design cycles and deliver increasingly complex products by advancing numerics research in high-performance computing. Ansys harnesses NVIDIA H100 Tensor Core GPUs to boost multiple simulation solutions and prioritizes NVIDIA Blackwell-based processors and NVIDIA Grace Hopper Superchips for products across the Ansys portfolio, including Ansys Fluent, Ansys LS-Dyna, and Ansys electronics and semiconductor products. Simultaneously, NVIDIA leverages Ansys technology, including semiconductor tools, to enrich virtual models and data center design, ultimately leading to accelerated Ansys solver performance.
- 6G Telecommunications: Ansys is among the first adopters of the NVIDIA 6G Research Cloud platform, allowing researchers a comprehensive suite to advance AI for radio access network (RAN) technology. Ansys Perceive EM, a new solver powered by Ansys HFSS™, builds on NVIDIA 6G Research Cloud, which is designed to speed the development of 6G technologies. Perceive EM’s synthetic data-on-demand revolutionizes 6G system digital twins with elevated predictive accuracy, capable of assessing how real-world conditions impact wireless network performance. Perceive EM will also be available within the Ansys Academic and Ansys Startup Programs, which have reached 2,900+ universities and 2,100+ startups, respectively.
- AI-Enhanced Simulation: Ansys is exploring the NVIDIA Modulus framework for physics-based machine learning to further boost its software offerings with the latest AI techniques. The work aims to deliver enhanced functionality within the Ansys AI+ product family, such as more efficient optimization, sensitivity analyses, and robust designs.
- AI Foundry: Ansys is examining the adoption of NVIDIA AI foundry to advance LLM development, furthering the democratization of simulation by simplifying setup and use. Future LLMs tailored to Ansys solutions offer the potential to provide expert virtual assistance that will open the door to new users and create new simulation use cases. Ansys intends to leverage the NVIDIA NeMo platform, which offers a set of tools that make it easier, more cost-effective, and faster to develop generative AI capabilities.
“We are excited to extend our collaboration with NVIDIA to enable a new frontier of generative AI and accelerated computing,” said Ajei Gopal, president and CEO at Ansys. “Within the dynamic realm of NVIDIA Omniverse, our visionary customers can propel innovation, bridging virtual and physical realities to shape tomorrow’s technologies and help solve the most pressing engineering challenges of our time.”
“Everything manufactured will have digital twins — and the world’s designers and engineers in heavy industry markets rely on Ansys as their simulation engine,” said Jensen Huang, founder and CEO of NVIDIA. “We’re collaborating with Ansys to bring accelerated computing and generative AI to these massive workloads, and to extend Ansys’ leading physics simulation tools with NVIDIA Omniverse digitalization technologies.”
Suggested Items
Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
05/09/2024 | ANSYSAnsys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.
Ansys Announces Q1 Financial Results
05/03/2024 | ANSYSANSYS, Inc. reported first quarter 2024 revenue of $466.6 million, a decrease of 8% in reported and constant currency, when compared to the first quarter of 2023.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).