GLOBALFOUNDRIES, Mentor Launch Semiconductor Verification Solution
September 24, 2020 | Globe NewswireEstimated reading time: 2 minutes
GLOBALFOUNDRIES, a leading specialty foundry, announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. Developed in collaboration with Mentor, a Siemens business, the new industry-leading ML-enhanced DFM solution, built on Mentor’s Calibre® nmDRC platform, can provide customers with a more effective design and development experience and, ultimately, contribute to a faster time to market.
The new ML-enhanced DFM kit is launching as an update to the process design kit (PDK) for GF’s 12LP+ differentiated semiconductor solution. Built on a proven platform with a robust production ecosystem, 12LP+ is optimized for artificial intelligence (AI) training and inference applications, and is currently ready for production at GF’s Fab 8 in Malta, New York.
GF’s new ML-enhanced DFM solution is among the first of its kind in the industry. GF plans to roll out the capability to the PDKs of its 12LP and 22FDX® semiconductor platforms in Q4 2020.
“We are excited to launch this new enhancement, infused with advanced machine learning models, and provide our customers with a quicker overall DFM verification and an even more effective design experience – all toward the goal of successful prototyping and a faster time to market,” said Jim Blatchford, vice president of Technology Enablement at GF. “Our close partnership with Mentor helped enable the new enhancement to be seamlessly integrated into our 12LP+ PDK, and we look forward to rolling out additional machine learning-infused capabilities in the PDKs for our other specialty semiconductor solutions.”
“We are pleased to partner with GLOBALFOUNDRIES to incorporate machine learning based models into Calibre nmDRC for GF’s 12LP+ platform,” said Michael White, director of Physical Verification Product Management, Calibre Design Solutions, at Mentor. “Working together with GLOBALFOUNDRIES, we have incorporated machine learning into the design flow to help create a seamless transition for our mutual customers."
Following its founding in 2009, GF has pioneered a DFM checking platform, called DRC+, which combines pattern-matching tools from electronic design automation (EDA) software suited with a proprietary library of yield detractor patterns. DRC+ enables chip designers to preventively detect defective patterns, or hotspots, in early designs that could lead to manufacturing defects.
GF and Mentor have partnered to integrate GF-developed ML models into DRC+, to help amplify the ability of DRC+ to recognize new and previously unseen hotspot patterns and improve production yield. Trained by GF on silicon data collected during its manufacturing operations, the new ML-enhanced DFM kit has been validated and qualified to enable chip designers to more successfully discover and mitigate potential problems early in the design process.
Catching and addressing these hotspots in the development phase is critical for designers as they progress toward successful prototyping and scale manufacturing.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.