TSMC Certifies Aprisa Place-and-Route Solution from Siemens on TSMC‘s N6 Process


Reading time ( words)

Siemens announced that its close collaboration with longtime foundry partner TSMC has resulted in the certification of its Aprisa place-and-route solution for TSMC’s advanced N6 process, a powerful enhancement of the broadly-adopted 7-nanometer (nm) family of technologies.

Siemens’ Aprisa product line is a leader in next-generation place-and-route technology for the design of highly advanced integrated-circuits (ICs). Engineered to help enable exceptional quality of results, the Aprisa tools offer complete gate-level-to-GDSII hierarchical and block level physical implementation solutions. Siemens acquired the Aprisa tools from Avatar Integrated Systems in August 2020 to extend its portfolio of world-class IC EDA software.

To achieve this latest certification, the Aprisa tools passed a suite of rigorous criteria to confirm that the Siemens place-and-route software is ready for mutual customers to start their IC designs on the TSMC N6 process.

“The innovative detailed-route-centric technology that powers our Aprisa tools is ideal for IC designs at advanced process nodes,” said Inki Hong, senior director of the Aprisa product line for Siemens Digital Industries Software. “The newest Aprisa certification that we achieved with TSMC further enables mutual customers to leverage Aprisa’s technology for design success at TSMC’s industry-leading N6 process.”

Under the Avatar banner, and now as a part of Siemens EDA, the Aprisa team has a long and successful history of collaboration with TSMC. In addition to previous collaboration for multiple technology nodes starting from 40nm down to 7nm, Aprisa is now qualified to run on TSMC’s highly advanced N6 technology.

“Our close collaboration with Siemens helps to ensure that our mutual customers have access to high-quality, certified physical design solutions,” said Suk Lee, vice president of Design Infrastructure Management Division at TSMC. “We look forward to our continued efforts to help our mutual customers achieve silicon success with design solutions on TSMC’s advanced processes.”

TSMC’s certified N6 functionality is available in Aprisa 20.1.rel.2 and later versions. Aprisa 20.1.rel.2 is available now from Siemens Digital Industries Software.

Share

Print


Suggested Items

My View from CES 2021: Day 1

01/12/2021 | Dan Feinberg, Technology Editor, I-Connect007
What a difference a year makes. One year ago, those of us who cover and attend CES were going from one press conference to the next; this year, we are at home going from link to link. Confusing and challenging, yes, but there are some advantages: no masks, only five steps to get to a restroom, being able to have three of four events or more displaying on your screens at the same time and being able to download press kits as needed. So far, many new devices are being introduced, but of course, they are all online, so you wonder if some of them really exist or are truly operational as yet.

CES 2021: Just How Different Will It Be?

01/11/2021 | Dan Feinberg, I-Connect007
CES 2021 starts today and this year there is no need for an overpriced hotel room in Vegas, no long lines to get a taxi or board a bus, and no crowded exhibit halls (one good thing this year). On the other hand, you must decide ahead of time what you want to see and make a reservation or appointment if you wish to have time and access assured.

CES 2020: The Intelligence of Things

01/06/2020 | Nolan Johnson, I-Connect007
Show week for CES 2020 starts well ahead of the actual exhibition dates because it is huge. The organizers of CES state that there are more than 4,400 exhibiting companies and nearly three million net square feet of exhibit space. On the floor, you can find 307 of the 2018 Fortune Global 500 companies. Over the week, I-Connect007 Editors Dan Feinberg and Nolan Johnson will bring you some of the most interesting news, products, and announcements from 5G to IoT, semiconductor developments, autonomous vehicle technology, interconnect, fabrication materials, and much more.



Copyright © 2021 I-Connect007. All rights reserved.