Siemens Selects Tangent Works to Democratize IoT Data Analytics for MindSphere
April 30, 2021 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announces a partnership with Tangent Works to deliver simple-to-use artificial intelligence (AI) capabilities to get more value from IoT data. The new AI for Everybody solution integrates the power of Tangent Works InstantML technology into MindSphere®, the industrial IoT as a service solution from Siemens, to enable users to instantly leverage IoT data collected by MindSphere to generate new insights without the need for complex model training and management.
Many organizations still struggle to scale their digital transformation projects and leverage IoT data using advanced artificial intelligence (AI) and machine learning (ML) technologies. Machine learning offers tremendous opportunities for industrial applications. However, it often requires deep knowledge about advanced statistics and how it’s applied in industrial use cases, as well as the scarce and expensive resource of data science experts.
“We are witnessing massive investments into digital and AI as companies get ready for post Covid-19 operations. Already before the pandemic, our research showed that a shortage of digital talent, especially in IT and data science, was the biggest challenge for companies looking to realize IoT, Industry 4.0 and AI initiatives,” said Knud Lasse Lueth, CEO at IoT Analytics. “This challenge will only get worse in the coming years and most firms will simply not find the experts that can build the machine learning models and integrate them into everyday operations. Companies that cannot find or afford these highly specialized digital employees will turn to low-code software tools to empower non-technical employees, or ‘citizen developers’.”
Using Tangent Works’ InstantML as an embedded component in MindSphere gives industrial users the ability to very quickly add AI capabilities to their MindSphere applications and solutions. With this approach, the IoT data stored in MindSphere can be instantly leveraged to generate actionable insights and prescriptive tools, enabling important industry use cases such as predictive maintenance, performance optimization, quality management and energy management.
“We always believed in the potential of our InstantML technology for industrial data,” said Henk De Metsenaere, co-founder of Tangent Works. “Now that Siemens, the true market leader in this space, has teamed up with Tangent Works this potential can be unlocked. The combination of Siemens’ MindSphere with Tangent Works’ InstantML technology will change the way industrial data will be used to the benefit of many of Siemens’ clients.”
“With the AI for Everybody solution, and with the integration of Tangent Works’ InstantML technology, customers and partners can now more quickly and easily extend the capabilities of MindSphere to better turn data into real and actionable insights and value,” said Raymond Kok, Senior Vice President of Cloud Application Solutions at Siemens Digital Industries Software. “With the ability to use AI/ML to generate hyper-automated predictive analytics, even citizen data scientists can leverage data and achieve immediate insights, at scale. This ultimately reduces complexity and puts the power of IoT data in the hands of the user.”
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).