Reading time ( words)
For the first time, IPC has formed a task group in Japan. The 7-31 BV-JP IPC J-STD-001/IPC-A-610 Automotive Addendum Task Group held its first meeting on June 14, 2022, to introduce task group members, discuss the IPC Works standards collaboration platform, and create a schedule for future task group meetings.
The automotive addendum requires the use of both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry. The 7-32 BV-JP task group will be guided by the principle of providing criteria to be used in addition to, and in some cases, in place of, those in the base documents to ensure the reliability of soldered electrical and electronic assemblies that must survive the automotive environment.
Members of the committee currently include the following companies: Tokai Rika (chair), Toyota Motor Corporation (vice-chair), Denso, Aisin, NSK, Panasonic, SiiX, Omron, Senju, Nihon Superior, Tamura SS, JAXA, NEC Platforms, Ltd., Harima Chemicals Group, Inc., and Japan Aviation Engineering.
Formed to enlist the input of Japan’s automotive industry, the task group encourages comments and proposals. As Yusaku Kono, IPC’s Japan representative, explains, “The goals of this group are to listen to comments from Japan’s automotive industry and to give proposals to the IPC 7-31BV global task group. The members of the group understand the value of providing feedback to strengthen IPC global standards and proactively support that goal.”
Nolan Johnson, I-Connect007
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
I-Connect007 Editorial Team
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.