FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Managing DDR4, DDR5, and HBM Supply Challenges

May 26, 2026 | Rob Ronan, Retronix Ltd.

The global electronics industry is no stranger to supply chain disruption, yet memory devices, particularly DRAM and NAND flash, sit at the center of a uniquely persistent challenge. The situation is particularly complex because constraints are not isolated; they are occurring simultaneously across both legacy and next-generation memory technologies. From DDR4 shortages driven by supplier exits to DDR5 demand being pulled by AI infrastructure, the market is facing a perfect storm of reduced supply, shifting demand, and aggressive pricing increases. For OEMs, EMS providers, and high-reliability sectors, this is a serious operational challenge.

Memorial Day Office Closure

May 25, 2026 | Nolan Johnson, I-Connect007

Memorial Day is, in my opinion, one of the most meaningful holidays observed in the United States. The holiday began as “Decoration Day,” when communities gathered to place flowers on the graves of fallen Civil War soldiers. Over time, the observance evolved into a national day of remembrance honoring all U.S. military personnel who gave their lives in service to the country. Today, Memorial Day is observed on the last Monday of May and is recognized as a federal holiday nationwide.

MORE ARTICLES
COLUMNS:

There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will...

There was a time when you could tell where a product was from by how it felt, fit, or functioned: German precision, Japanese consistency, or American durability. Today, the lines are blurred. The best factories in Vietnam rival those...

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

May 13, 2026 | Nash Bell, Knocking Down the Bone Pile

Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder...

Learning with Leo: Drones—Meeting Demand Without Compromise

May 6, 2026 | Leo Lambert, Learning With Leo

With drones used in a wide range of applications today, particularly in modern military conflicts, domestic manufacturers are feeling pressure to produce at high volume and low cost, particularly within an NDAA supply chain ecosystem...

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